VLSI Wiki
Contents:
  1. ATE Testing
    1. 1. Definition: What is ATE Testing?
    2. 2. Components and Operating Principles
      1. 2.1 Test Patterns
    3. 3. Related Technologies and Comparison
    4. 4. References
    5. 5. One-line Summary

ATE Testing

1. Definition: What is ATE Testing?

ATE Testing (Automated Test Equipment Testing)๋Š” ๋ฐ˜๋„์ฒด ์žฅ์น˜ ๋ฐ ์‹œ์Šคํ…œ์˜ ์‹ ๋ขฐ์„ฑ๊ณผ ์„ฑ๋Šฅ์„ ํ‰๊ฐ€ํ•˜๊ธฐ ์œ„ํ•ด ์‚ฌ์šฉ๋˜๋Š” ์ž๋™ํ™”๋œ ํ…Œ์ŠคํŠธ ์žฅ๋น„๋ฅผ ์ด์šฉํ•œ ํ…Œ์ŠคํŠธ ํ”„๋กœ์„ธ์Šค๋ฅผ ์˜๋ฏธํ•ฉ๋‹ˆ๋‹ค. ์ด ๊ณผ์ •์€ Digital Circuit Design์—์„œ ์ค‘์š”ํ•œ ์—ญํ• ์„ ํ•˜๋ฉฐ, ๋ฐ˜๋„์ฒด ์†Œ์ž์˜ ์ œ์กฐ ํ›„ ํ’ˆ์งˆ ๋ณด์ฆ์„ ์œ„ํ•œ ํ•„์ˆ˜์ ์ธ ๋‹จ๊ณ„์ž…๋‹ˆ๋‹ค. ATE Testing์€ ๋‹ค์–‘ํ•œ ์ „๊ธฐ์  ํŠน์„ฑ ๋ฐ ๊ธฐ๋Šฅ์„ ๊ฒ€์ฆํ•˜๊ธฐ ์œ„ํ•ด ์„ค๊ณ„๋œ ํ…Œ์ŠคํŠธ ํŒจํ„ด์„ ์‚ฌ์šฉํ•˜์—ฌ ์†Œ์ž์˜ ๋™์ž‘์„ ํ‰๊ฐ€ํ•ฉ๋‹ˆ๋‹ค.

ATE Testing์˜ ์ค‘์š”์„ฑ์€ ์—ฌ๋Ÿฌ ์ธก๋ฉด์—์„œ ๋‚˜ํƒ€๋‚ฉ๋‹ˆ๋‹ค. ์ฒซ์งธ, ๋ฐ˜๋„์ฒด ์†Œ์ž์˜ ๋ณต์žก์„ฑ์ด ์ฆ๊ฐ€ํ•จ์— ๋”ฐ๋ผ, ์ œ์กฐ ๊ณผ์ •์—์„œ์˜ ๊ฒฐํ•จ์„ ์กฐ๊ธฐ์— ๋ฐœ๊ฒฌํ•˜๋Š” ๊ฒƒ์ด ํ•„์ˆ˜์ ์ž…๋‹ˆ๋‹ค. ATE Testing์€ ์ด๋Ÿฌํ•œ ๊ฒฐํ•จ์„ ์‹๋ณ„ํ•˜๊ณ , ์ œํ’ˆ์˜ ์‹ ๋ขฐ์„ฑ์„ ๋†’์ด๋ฉฐ, ๊ณ ๊ฐ์˜ ์š”๊ตฌ๋ฅผ ์ถฉ์กฑํ•˜๋Š” ๋ฐ ๊ธฐ์—ฌํ•ฉ๋‹ˆ๋‹ค. ๋‘˜์งธ, ATE Testing์€ ๋น„์šฉ ํšจ์œจ์ ์ธ ๋ฐฉ๋ฒ•์œผ๋กœ ๋Œ€๋Ÿ‰ ์ƒ์‚ฐ๋œ ๋ฐ˜๋„์ฒด ์†Œ์ž์˜ ํ’ˆ์งˆ์„ ๋ณด์žฅํ•  ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค. ์ด๋Š” ์ œ์กฐ์—…์ฒด๊ฐ€ ์‹œ์žฅ ๊ฒฝ์Ÿ๋ ฅ์„ ์œ ์ง€ํ•˜๋Š” ๋ฐ ์ค‘์š”ํ•œ ์š”์†Œ์ž…๋‹ˆ๋‹ค.

ATE Testing์˜ ๊ธฐ์ˆ ์  ํŠน์„ฑ์€ ๋‹ค์–‘ํ•œ ํ…Œ์ŠคํŠธ ๋ฐฉ๋ฒ•๋ก ๊ณผ ์ ˆ์ฐจ๋ฅผ ํฌํ•จํ•ฉ๋‹ˆ๋‹ค. ์˜ˆ๋ฅผ ๋“ค์–ด, ๋™์  ์‹œ๋ฎฌ๋ ˆ์ด์…˜(Dynamic Simulation), ํƒ€์ด๋ฐ(Timing) ๋ถ„์„, ํšŒ๋กœ(Circuit) ๋™์ž‘ ๊ฒ€์ฆ ๋“ฑ์ด ์žˆ์Šต๋‹ˆ๋‹ค. ์ด๋Ÿฌํ•œ ๊ธฐ์ˆ ๋“ค์€ ATE Testing์ด ๋‹ค์–‘ํ•œ ์œ ํ˜•์˜ ๋ฐ˜๋„์ฒด ์†Œ์ž์— ์ ํ•ฉํ•˜๋„๋ก ์„ค๊ณ„๋˜์—ˆ์Œ์„ ๋ณด์—ฌ์ค๋‹ˆ๋‹ค. ATE ์‹œ์Šคํ…œ์€ ๋ณต์žกํ•œ ํ…Œ์ŠคํŠธ ํ™˜๊ฒฝ์„ ๊ตฌ์„ฑํ•˜๊ณ , ์—ฌ๋Ÿฌ ํ…Œ์ŠคํŠธ ์ฑ„๋„์„ ๋™์‹œ์— ์šด์˜ํ•˜์—ฌ ํšจ์œจ์ ์ธ ํ…Œ์ŠคํŠธ๋ฅผ ์ˆ˜ํ–‰ํ•  ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค.

2. Components and Operating Principles

ATE Testing์˜ ๊ตฌ์„ฑ ์š”์†Œ๋Š” ์—ฌ๋Ÿฌ ๊ฐ€์ง€๋กœ ๋‚˜๋ˆŒ ์ˆ˜ ์žˆ์œผ๋ฉฐ, ๊ฐ ๊ตฌ์„ฑ ์š”์†Œ๋Š” ํŠน์ •ํ•œ ์—ญํ• ์„ ์ˆ˜ํ–‰ํ•˜์—ฌ ์ „์ฒด ํ…Œ์ŠคํŠธ ํ”„๋กœ์„ธ์Šค๋ฅผ ์ง€์›ํ•ฉ๋‹ˆ๋‹ค. ์ฃผ์š” ๊ตฌ์„ฑ ์š”์†Œ๋Š” ๋‹ค์Œ๊ณผ ๊ฐ™์Šต๋‹ˆ๋‹ค.

  1. Test Head: ATE ์‹œ์Šคํ…œ์˜ ๊ฐ€์žฅ ์ค‘์š”ํ•œ ๋ถ€๋ถ„์œผ๋กœ, DUT(Design Under Test)์™€ ์ง์ ‘ ์—ฐ๊ฒฐ๋ฉ๋‹ˆ๋‹ค. Test Head๋Š” DUT์˜ ํ•€์— ์ „๊ธฐ์  ์‹ ํ˜ธ๋ฅผ ์ „๋‹ฌํ•˜๊ณ , DUT์—์„œ ๋ฐœ์ƒํ•˜๋Š” ์‘๋‹ต์„ ์ˆ˜์ง‘ํ•ฉ๋‹ˆ๋‹ค.

  2. Signal Generators: ATE ์‹œ์Šคํ…œ ๋‚ด์—์„œ ๋‹ค์–‘ํ•œ ์ „๊ธฐ ์‹ ํ˜ธ๋ฅผ ์ƒ์„ฑํ•˜๋Š” ์žฅ์น˜์ž…๋‹ˆ๋‹ค. ์ด ์‹ ํ˜ธ๋“ค์€ DUT์˜ ๋™์ž‘์„ ์œ ๋„ํ•˜๊ณ , ๋‹ค์–‘ํ•œ ํ…Œ์ŠคํŠธ ์‹œ๋‚˜๋ฆฌ์˜ค๋ฅผ ์‹คํ–‰ํ•˜๋Š” ๋ฐ ์‚ฌ์šฉ๋ฉ๋‹ˆ๋‹ค.

  3. Measurement Instruments: DUT์˜ ์‘๋‹ต์„ ์ธก์ •ํ•˜๋Š” ๋ฐ ์‚ฌ์šฉ๋˜๋Š” ์žฅ๋น„๋กœ, ์ „์••, ์ „๋ฅ˜, ์ฃผํŒŒ์ˆ˜ ๋“ฑ์˜ ๋‹ค์–‘ํ•œ ์ „๊ธฐ์  ํŠน์„ฑ์„ ์ธก์ •ํ•ฉ๋‹ˆ๋‹ค. ์ด ๋ฐ์ดํ„ฐ๋Š” DUT์˜ ์„ฑ๋Šฅ์„ ํ‰๊ฐ€ํ•˜๋Š” ๋ฐ ์ค‘์š”ํ•œ ์—ญํ• ์„ ํ•ฉ๋‹ˆ๋‹ค.

  4. Controller: ATE ์‹œ์Šคํ…œ์˜ ์ค‘์•™ ์ฒ˜๋ฆฌ ์žฅ์น˜๋กœ, ํ…Œ์ŠคํŠธ ํ”„๋กœ์„ธ์Šค๋ฅผ ์ œ์–ดํ•˜๊ณ , ํ…Œ์ŠคํŠธ ํŒจํ„ด์„ ์ƒ์„ฑํ•˜๋ฉฐ, ์ˆ˜์ง‘๋œ ๋ฐ์ดํ„ฐ๋ฅผ ๋ถ„์„ํ•ฉ๋‹ˆ๋‹ค. Controller๋Š” ๋‹ค์–‘ํ•œ ํ…Œ์ŠคํŠธ ์•Œ๊ณ ๋ฆฌ์ฆ˜์„ ์‹คํ–‰ํ•˜์—ฌ DUT์˜ ๋™์ž‘์„ ํ‰๊ฐ€ํ•ฉ๋‹ˆ๋‹ค.

  5. Software: ATE ์‹œ์Šคํ…œ์˜ ์šด์˜์„ ์ง€์›ํ•˜๋Š” ์†Œํ”„ํŠธ์›จ์–ด๋กœ, ํ…Œ์ŠคํŠธ ๊ณ„ํš์„ ์ˆ˜๋ฆฝํ•˜๊ณ , ํ…Œ์ŠคํŠธ ๊ฒฐ๊ณผ๋ฅผ ๋ถ„์„ํ•˜๋Š” ๊ธฐ๋Šฅ์„ ์ œ๊ณตํ•ฉ๋‹ˆ๋‹ค. ์ด ์†Œํ”„ํŠธ์›จ์–ด๋Š” ์‚ฌ์šฉ์ž ์นœํ™”์ ์ธ ์ธํ„ฐํŽ˜์ด์Šค๋ฅผ ํ†ตํ•ด ํ…Œ์ŠคํŠธ ํ”„๋กœ์„ธ์Šค๋ฅผ ๊ฐ„์†Œํ™”ํ•ฉ๋‹ˆ๋‹ค.

ATE Testing์˜ ์šด์˜ ์›๋ฆฌ๋Š” ๋‹ค์Œ๊ณผ ๊ฐ™์ด ์„ค๋ช…ํ•  ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค. ๋จผ์ €, Controller๋Š” DUT์— ๋Œ€ํ•œ ํ…Œ์ŠคํŠธ ๊ณ„ํš์„ ์ˆ˜๋ฆฝํ•˜๊ณ , Signal Generators๋ฅผ ํ†ตํ•ด ํ•„์š”ํ•œ ํ…Œ์ŠคํŠธ ์‹ ํ˜ธ๋ฅผ ์ƒ์„ฑํ•ฉ๋‹ˆ๋‹ค. ์ƒ์„ฑ๋œ ์‹ ํ˜ธ๋Š” Test Head๋ฅผ ํ†ตํ•ด DUT์— ์ „๋‹ฌ๋ฉ๋‹ˆ๋‹ค. DUT์˜ ์‘๋‹ต์€ Measurement Instruments๋ฅผ ํ†ตํ•ด ์ˆ˜์ง‘๋˜๊ณ , ์ด ๋ฐ์ดํ„ฐ๋Š” Controller์— ์˜ํ•ด ๋ถ„์„๋ฉ๋‹ˆ๋‹ค. ๋งˆ์ง€๋ง‰์œผ๋กœ, ํ…Œ์ŠคํŠธ ๊ฒฐ๊ณผ๋Š” ์†Œํ”„ํŠธ์›จ์–ด๋ฅผ ํ†ตํ•ด ์‹œ๊ฐํ™”๋˜๊ณ , ํ’ˆ์งˆ ๋ณด์ฆ ๋ฐ ๊ฐœ์„ ์„ ์œ„ํ•œ ์ž๋ฃŒ๋กœ ํ™œ์šฉ๋ฉ๋‹ˆ๋‹ค.

2.1 Test Patterns

ATE Testing์—์„œ ์‚ฌ์šฉ๋˜๋Š” ํ…Œ์ŠคํŠธ ํŒจํ„ด์€ DUT์˜ ๊ธฐ๋Šฅ์„ ๊ฒ€์ฆํ•˜๊ธฐ ์œ„ํ•ด ์„ค๊ณ„๋œ ํŠน์ •ํ•œ ์ž…๋ ฅ ์‹ ํ˜ธ ์ง‘ํ•ฉ์ž…๋‹ˆ๋‹ค. ์ด ํŒจํ„ด๋“ค์€ DUT์˜ ๋‹ค์–‘ํ•œ ๋™์ž‘ ์ƒํƒœ๋ฅผ ์‹œ๋ฎฌ๋ ˆ์ด์…˜ํ•˜๋ฉฐ, ๊ฐ ํŒจํ„ด์— ๋Œ€ํ•œ DUT์˜ ์‘๋‹ต์„ ๋ถ„์„ํ•˜์—ฌ ๊ฒฐํ•จ์„ ์‹๋ณ„ํ•ฉ๋‹ˆ๋‹ค. ํ…Œ์ŠคํŠธ ํŒจํ„ด์€ ์ผ๋ฐ˜์ ์œผ๋กœ ๋‹ค์Œ๊ณผ ๊ฐ™์€ ๋ฐฉ์‹์œผ๋กœ ์ƒ์„ฑ๋ฉ๋‹ˆ๋‹ค:

  • Functional Patterns: DUT์˜ ๊ธฐ๋Šฅ์  ๋™์ž‘์„ ๊ฒ€์ฆํ•˜๊ธฐ ์œ„ํ•œ ํŒจํ„ด์œผ๋กœ, ํŠน์ • ๊ธฐ๋Šฅ์„ ์ˆ˜ํ–‰ํ•˜๋Š” ๋ฐ ํ•„์š”ํ•œ ์ž…๋ ฅ์„ ํฌํ•จํ•ฉ๋‹ˆ๋‹ค.
  • Structural Patterns: DUT์˜ ๋‚ด๋ถ€ ๊ตฌ์กฐ๋ฅผ ๊ฒ€์ฆํ•˜๊ธฐ ์œ„ํ•œ ํŒจํ„ด์œผ๋กœ, ๊ฐ ํšŒ๋กœ ๊ฒฝ๋กœ์˜ ๋™์ž‘์„ ํ™•์ธํ•ฉ๋‹ˆ๋‹ค.

ATE Testing์€ ์—ฌ๋Ÿฌ ์œ ์‚ฌ ๊ธฐ์ˆ  ๋ฐ ๋ฐฉ๋ฒ•๋ก ๊ณผ ๋น„๊ตํ•  ์ˆ˜ ์žˆ์œผ๋ฉฐ, ๊ฐ ๊ธฐ์ˆ ์˜ ํŠน์„ฑ๊ณผ ์žฅ๋‹จ์ ์„ ์ดํ•ดํ•˜๋Š” ๊ฒƒ์ด ์ค‘์š”ํ•ฉ๋‹ˆ๋‹ค. ATE Testing๊ณผ ๋น„๊ตํ•  ์ˆ˜ ์žˆ๋Š” ๊ธฐ์ˆ ๋กœ๋Š” ๋‹ค์Œ๊ณผ ๊ฐ™์€ ๊ฒƒ๋“ค์ด ์žˆ์Šต๋‹ˆ๋‹ค.

  1. In-Circuit Testing (ICT): ICT๋Š” ๋ฐ˜๋„์ฒด ์†Œ์ž๊ฐ€ PCB(Printed Circuit Board)์— ์žฅ์ฐฉ๋œ ํ›„, ๊ฐ ์†Œ์ž์˜ ์ „๊ธฐ์  ํŠน์„ฑ์„ ํ…Œ์ŠคํŠธํ•˜๋Š” ๋ฐฉ๋ฒ•์ž…๋‹ˆ๋‹ค. ATE Testing์€ ๋Œ€๋Ÿ‰ ์ƒ์‚ฐ์— ์ ํ•ฉํ•˜์ง€๋งŒ, ICT๋Š” ๊ฐœ๋ณ„ ๋ถ€ํ’ˆ์˜ ๊ฒฐํ•จ์„ ๋น ๋ฅด๊ฒŒ ๋ฐœ๊ฒฌํ•˜๋Š” ๋ฐ ์œ ๋ฆฌํ•ฉ๋‹ˆ๋‹ค. ๊ทธ๋Ÿฌ๋‚˜ ICT๋Š” ํ…Œ์ŠคํŠธ ์‹œ๊ฐ„์ด ๊ธธ๊ณ , ๋น„์šฉ์ด ์ƒ๋Œ€์ ์œผ๋กœ ๋†’์„ ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค.

  2. Functional Testing: ATE Testing๊ณผ ์œ ์‚ฌํ•˜๊ฒŒ DUT์˜ ๊ธฐ๋Šฅ์„ ๊ฒ€์ฆํ•˜์ง€๋งŒ, Functional Testing์€ ์ผ๋ฐ˜์ ์œผ๋กœ ์†Œํ”„ํŠธ์›จ์–ด ๊ธฐ๋ฐ˜์œผ๋กœ ์ˆ˜ํ–‰๋ฉ๋‹ˆ๋‹ค. ATE Testing์€ ํ•˜๋“œ์›จ์–ด ํ…Œ์ŠคํŠธ์— ๋” ์ ํ•ฉํ•˜๋ฉฐ, ๋Œ€๋Ÿ‰ ์ƒ์‚ฐ์—์„œ์˜ ํšจ์œจ์„ฑ์„ ๋†’์ด๋Š” ๋ฐ ์ค‘์ ์„ ๋‘ก๋‹ˆ๋‹ค.

  3. Boundary Scan Testing: ์ด ๋ฐฉ๋ฒ•์€ JTAG(Join Test Action Group) ์ธํ„ฐํŽ˜์ด์Šค๋ฅผ ์‚ฌ์šฉํ•˜์—ฌ ํšŒ๋กœ์˜ ๊ฒฝ๊ณ„์—์„œ ์‹ ํ˜ธ๋ฅผ ์ธก์ •ํ•ฉ๋‹ˆ๋‹ค. Boundary Scan์€ ๋ณต์žกํ•œ ํšŒ๋กœ์˜ ํ…Œ์ŠคํŠธ๋ฅผ ์‰ฝ๊ฒŒ ํ•  ์ˆ˜ ์žˆ๋„๋ก ๋„์™€์ฃผ์ง€๋งŒ, ATE Testing์€ ๋” ๋งŽ์€ ์ „๊ธฐ์  ํŠน์„ฑ์„ ๋™์‹œ์— ํ‰๊ฐ€ํ•  ์ˆ˜ ์žˆ๋Š” ์žฅ์ ์ด ์žˆ์Šต๋‹ˆ๋‹ค.

ATE Testing์˜ ์ฃผ์š” ์žฅ์ ์€ ๋†’์€ ์‹ ๋ขฐ์„ฑ๊ณผ ํšจ์œจ์„ฑ์ž…๋‹ˆ๋‹ค. ๋Œ€๋Ÿ‰ ์ƒ์‚ฐ ํ™˜๊ฒฝ์—์„œ ATE Testing์€ ํ’ˆ์งˆ ๋ณด์ฆ์„ ์œ„ํ•œ ํ•„์ˆ˜์ ์ธ ๋„๊ตฌ๋กœ ์ž๋ฆฌ ์žก๊ณ  ์žˆ์œผ๋ฉฐ, ๋ฐ˜๋„์ฒด ์‚ฐ์—…์˜ ๋ฐœ์ „์— ๊ธฐ์—ฌํ•˜๊ณ  ์žˆ์Šต๋‹ˆ๋‹ค. ๋ฐ˜๋ฉด, ATE Testing์˜ ๋‹จ์ ์€ ์ดˆ๊ธฐ ํˆฌ์ž ๋น„์šฉ์ด ๋†’๊ณ , ๋ณต์žกํ•œ ์‹œ์Šคํ…œ ์„ค๊ณ„๊ฐ€ ํ•„์š”ํ•˜๋‹ค๋Š” ์ ์ž…๋‹ˆ๋‹ค.

4. References

  • IEEE (Institute of Electrical and Electronics Engineers)
  • SEMI (Semiconductor Equipment and Materials International)
  • ATE Solutions, Inc.
  • National Instruments
  • Teradyne, Inc.

5. One-line Summary

ATE Testing์€ ๋ฐ˜๋„์ฒด ์†Œ์ž์˜ ์‹ ๋ขฐ์„ฑ๊ณผ ์„ฑ๋Šฅ์„ ํ‰๊ฐ€ํ•˜๊ธฐ ์œ„ํ•œ ์ž๋™ํ™”๋œ ํ…Œ์ŠคํŠธ ์žฅ๋น„๋ฅผ ํ™œ์šฉํ•œ ํ•„์ˆ˜์ ์ธ ํ’ˆ์งˆ ๋ณด์ฆ ํ”„๋กœ์„ธ์Šค์ž…๋‹ˆ๋‹ค.