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Contents:
  1. decap cell
    1. 1. Definition: What is decap cell?
    2. 2. Components and Operating Principles
      1. 2.1 Components
      2. 2.2 Operating Principles
    3. 3. Related Technologies and Comparison
    4. 4. References
    5. 5. One-line Summary

decap cell

1. Definition: What is decap cell?

Decap cell๋Š” ๋ฐ˜๋„์ฒด ์†Œ์ž ์„ค๊ณ„์—์„œ ์ค‘์š”ํ•œ ์—ญํ• ์„ ํ•˜๋Š” ์ˆ˜๋™ ์†Œ์ž๋กœ, ์ฃผ๋กœ VLSI ์‹œ์Šคํ…œ์—์„œ ์ „์•• ์•ˆ์ •์„ฑ์„ ์œ ์ง€ํ•˜๊ณ  ์ „๋ ฅ ๊ณต๊ธ‰์˜ ๋ณ€๋™์„ ์™„ํ™”ํ•˜๋Š” ๋ฐ ์‚ฌ์šฉ๋ฉ๋‹ˆ๋‹ค. ์ด๋Ÿฌํ•œ ์…€์€ ๋””์ง€ํ„ธ ํšŒ๋กœ ์„ค๊ณ„์—์„œ ํ•„์ˆ˜์ ์ธ ์š”์†Œ๋กœ, ์ „์› ๊ณต๊ธ‰๋ง์˜ ์žก์Œ์„ ์ค„์ด๊ณ  ์‹ ํ˜ธ์˜ ๋ฌด๊ฒฐ์„ฑ์„ ๋ณด์žฅํ•˜๋Š” ๋ฐ ๊ธฐ์—ฌํ•ฉ๋‹ˆ๋‹ค.

Decap cell์€ ์ฃผ๋กœ ์ปคํŒจ์‹œํ„ฐ๋กœ ๊ตฌ์„ฑ๋˜์–ด ์žˆ์œผ๋ฉฐ, ์ด๋Š” ์ „ํ•˜๋ฅผ ์ €์žฅํ•˜๊ณ  ๋ฐฉ์ถœํ•˜๋Š” ๋Šฅ๋ ฅ์„ ํ†ตํ•ด ํšŒ๋กœ์˜ ๋™์  ๋™์ž‘์„ ์ง€์›ํ•ฉ๋‹ˆ๋‹ค. ์ „์•• ๋ณ€๋™์ด ๋ฐœ์ƒํ•  ๋•Œ, decap cell์€ ์ „ํ•˜๋ฅผ ๊ณต๊ธ‰ํ•˜๊ฑฐ๋‚˜ ํก์ˆ˜ํ•˜์—ฌ ์ „์› ๋ ˆ์ผ์˜ ์ „์••์„ ์ผ์ •ํ•˜๊ฒŒ ์œ ์ง€ํ•ฉ๋‹ˆ๋‹ค. ์ด๋Ÿฌํ•œ ๊ธฐ๋Šฅ์€ ํŠนํžˆ ๊ณ ์† ํšŒ๋กœ์—์„œ ์ค‘์š”ํ•˜๋ฉฐ, ํšŒ๋กœ์˜ ๋™์ž‘ ์ฃผํŒŒ์ˆ˜๊ฐ€ ์ฆ๊ฐ€ํ•จ์— ๋”ฐ๋ผ ์ „๋ ฅ ๊ณต๊ธ‰์˜ ์•ˆ์ •์„ฑ์ด ๋”์šฑ ์š”๊ตฌ๋ฉ๋‹ˆ๋‹ค.

Decap cell์˜ ์ค‘์š”์„ฑ์€ ๋‹ค์Œ๊ณผ ๊ฐ™์€ ์ด์œ ์—์„œ ๊ธฐ์ธํ•ฉ๋‹ˆ๋‹ค. ์ฒซ์งธ, ๋””์ง€ํ„ธ ํšŒ๋กœ์—์„œ ๋ฐœ์ƒํ•  ์ˆ˜ ์žˆ๋Š” ์ „์•• ๊ฐ•ํ•˜ ๋ฐ ์ŠคํŒŒ์ดํฌ๋ฅผ ์™„ํ™”ํ•˜์—ฌ ํšŒ๋กœ์˜ ์ „๋ฐ˜์ ์ธ ์„ฑ๋Šฅ์„ ํ–ฅ์ƒ์‹œํ‚ต๋‹ˆ๋‹ค. ๋‘˜์งธ, ์ „๋ ฅ ์†Œ๋น„๋ฅผ ์ตœ์ ํ™”ํ•˜์—ฌ ์—ด ๋ฐœ์ƒ์„ ์ค„์ด๊ณ , ์ด๋Š” ๋ฐ˜๋„์ฒด ์žฅ์น˜์˜ ์‹ ๋ขฐ์„ฑ์„ ๋†’์ด๋Š” ๋ฐ ๊ธฐ์—ฌํ•ฉ๋‹ˆ๋‹ค. ๋งˆ์ง€๋ง‰์œผ๋กœ, decap cell์€ ์ œ์กฐ ๊ณต์ •์—์„œ์˜ ๋ณ€๋™์„ฑ์„ ๋ณด์™„ํ•˜์—ฌ ์„ค๊ณ„์˜ ์ผ๊ด€์„ฑ์„ ์œ ์ง€ํ•˜๋Š” ๋ฐ ๋„์›€์„ ์ค๋‹ˆ๋‹ค. ์ด๋Ÿฌํ•œ ์ด์œ ๋กœ, decap cell์€ ํ˜„๋Œ€ ์ „์ž ๊ธฐ๊ธฐ์—์„œ ํ•„์ˆ˜์ ์ธ ๊ตฌ์„ฑ ์š”์†Œ๋กœ ์ž๋ฆฌ ์žก๊ณ  ์žˆ์Šต๋‹ˆ๋‹ค.

2. Components and Operating Principles

Decap cell์€ ์ฃผ๋กœ ์ปคํŒจ์‹œํ„ฐ๋กœ ๊ตฌ์„ฑ๋˜์–ด ์žˆ์œผ๋ฉฐ, ๊ทธ ์ž‘๋™ ์›๋ฆฌ๋Š” ์ „ํ•˜ ์ €์žฅ ๋ฐ ๋ฐฉ์ถœ์— ๊ธฐ๋ฐ˜ํ•ฉ๋‹ˆ๋‹ค. ์ด๋Ÿฌํ•œ ์ปคํŒจ์‹œํ„ฐ๋Š” ์ผ๋ฐ˜์ ์œผ๋กœ ํ‰๋ฉด ๊ตฌ์กฐ ๋˜๋Š” 3D ๊ตฌ์กฐ๋กœ ์„ค๊ณ„๋˜๋ฉฐ, ๋‹ค์–‘ํ•œ ๋ฌผ์งˆ(์˜ˆ: SiO2, HfO2 ๋“ฑ)์„ ์‚ฌ์šฉํ•˜์—ฌ ์ œ์กฐ๋ฉ๋‹ˆ๋‹ค.

2.1 Components

  1. Capacitance: Decap cell์˜ ํ•ต์‹ฌ ๊ตฌ์„ฑ ์š”์†Œ๋Š” ์ปคํŒจ์‹œํ„ด์Šค์ž…๋‹ˆ๋‹ค. ์ปคํŒจ์‹œํ„ด์Šค๋Š” ์ „ํ•˜๋ฅผ ์ €์žฅํ•˜๋Š” ๋Šฅ๋ ฅ์„ ๋‚˜ํƒ€๋‚ด๋ฉฐ, ์ด๋Š” ์ „์••์˜ ๋ณ€ํ™”์— ๋”ฐ๋ผ ์ „ํ•˜๋ฅผ ๊ณต๊ธ‰ํ•˜๊ฑฐ๋‚˜ ๋ฐฉ์ถœํ•˜๋Š” ๋ฐ ์ค‘์š”ํ•œ ์—ญํ• ์„ ํ•ฉ๋‹ˆ๋‹ค. ์ปคํŒจ์‹œํ„ฐ์˜ ํฌ๊ธฐ์™€ ๊ตฌ์กฐ๋Š” ํ•„์š”ํ•œ ์ปคํŒจ์‹œํ„ด์Šค ๊ฐ’์— ๋”ฐ๋ผ ๊ฒฐ์ •๋ฉ๋‹ˆ๋‹ค.

  2. Layout Design: Decap cell์˜ ๋ ˆ์ด์•„์›ƒ ์„ค๊ณ„๋Š” ์ „๊ธฐ์  ์„ฑ๋Šฅ์— ํฐ ์˜ํ–ฅ์„ ๋ฏธ์นฉ๋‹ˆ๋‹ค. ์ปคํŒจ์‹œํ„ฐ์˜ ๋ฐฐ์น˜, ์ ‘์ง€ ์—ฐ๊ฒฐ, ๊ทธ๋ฆฌ๊ณ  ๋‹ค๋ฅธ ํšŒ๋กœ ์š”์†Œ์™€์˜ ์ƒํ˜ธ์ž‘์šฉ์€ ๋ชจ๋‘ ํšŒ๋กœ์˜ ์ „๋ฐ˜์ ์ธ ์„ฑ๋Šฅ์„ ์ขŒ์šฐํ•ฉ๋‹ˆ๋‹ค. ์ตœ์ ์˜ ๋ ˆ์ด์•„์›ƒ์„ ํ†ตํ•ด ์ „์ž๊ธฐ ๊ฐ„์„ญ(EMI)์„ ์ตœ์†Œํ™”ํ•˜๊ณ , ์‹ ํ˜ธ์˜ ๋ฌด๊ฒฐ์„ฑ์„ ๋ณด์žฅํ•  ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค.

  3. Interface with Power Network: Decap cell์€ ์ „์› ๋„คํŠธ์›Œํฌ์™€ ๋ฐ€์ ‘ํ•˜๊ฒŒ ์—ฐ๊ฒฐ๋˜์–ด ์žˆ์Šต๋‹ˆ๋‹ค. ์ „์› ๋ ˆ์ผ๊ณผ์˜ ์—ฐ๊ฒฐ์€ ์ „์•• ๋ณ€๋™์„ ์‹ ์†ํ•˜๊ฒŒ ๋ณด์ •ํ•  ์ˆ˜ ์žˆ๋„๋ก ์„ค๊ณ„๋˜์–ด์•ผ ํ•˜๋ฉฐ, ์ด๋Š” ํšŒ๋กœ์˜ ๋ฐ˜์‘ ์†๋„์— ์˜ํ–ฅ์„ ๋ฏธ์นฉ๋‹ˆ๋‹ค.

2.2 Operating Principles

Decap cell์˜ ์ž‘๋™ ์›๋ฆฌ๋Š” ์ „์••์˜ ์ˆœ๊ฐ„์ ์ธ ๋ณ€ํ™”์— ๋Œ€ํ•œ ๋ฐ˜์‘์„ ํ†ตํ•ด ์ด๋ฃจ์–ด์ง‘๋‹ˆ๋‹ค. ํšŒ๋กœ์—์„œ ์ „์•• ์ŠคํŒŒ์ดํฌ๊ฐ€ ๋ฐœ์ƒํ•˜๋ฉด, decap cell์€ ์ €์žฅ๋œ ์ „ํ•˜๋ฅผ ๋ฐฉ์ถœํ•˜์—ฌ ์ „์••์„ ์•ˆ์ •ํ™”ํ•ฉ๋‹ˆ๋‹ค. ๋ฐ˜๋Œ€๋กœ, ์ „์••์ด ๊ธ‰๊ฒฉํžˆ ๋–จ์–ด์งˆ ๊ฒฝ์šฐ, decap cell์€ ์™ธ๋ถ€์—์„œ ์ „ํ•˜๋ฅผ ํก์ˆ˜ํ•˜์—ฌ ์ „์••์„ ์œ ์ง€ํ•ฉ๋‹ˆ๋‹ค. ์ด๋Ÿฌํ•œ ๊ณผ์ •์€ ํšŒ๋กœ์˜ ๋™์  ์‹œ๋ฎฌ๋ ˆ์ด์…˜์—์„œ ์ค‘์š”ํ•œ ์š”์†Œ๋กœ ์ž‘์šฉํ•˜๋ฉฐ, ํšŒ๋กœ์˜ ํƒ€์ด๋ฐ๊ณผ ์‹ ํ˜ธ ์ „ํŒŒ์— ์ง์ ‘์ ์ธ ์˜ํ–ฅ์„ ๋ฏธ์นฉ๋‹ˆ๋‹ค.

Decap cell์˜ ์„ฑ๋Šฅ์€ ์ฃผํŒŒ์ˆ˜์— ๋”ฐ๋ผ ๋‹ค๋ฅด๊ฒŒ ๋‚˜ํƒ€๋‚ฉ๋‹ˆ๋‹ค. ๊ณ ์ฃผํŒŒ์ˆ˜์—์„œ๋Š” ์ „์•• ๋ณ€๋™์ด ๋” ๋นˆ๋ฒˆํ•˜๊ฒŒ ๋ฐœ์ƒํ•˜๋ฏ€๋กœ, decap cell์˜ ์ปคํŒจ์‹œํ„ด์Šค ๊ฐ’๊ณผ ๋ฐ˜์‘ ์†๋„๊ฐ€ ๋”์šฑ ์ค‘์š”ํ•ด์ง‘๋‹ˆ๋‹ค. ๋”ฐ๋ผ์„œ, ์„ค๊ณ„์ž๋Š” ๋‹ค์–‘ํ•œ ์ฃผํŒŒ์ˆ˜ ๋Œ€์—ญ์—์„œ decap cell์˜ ์„ฑ๋Šฅ์„ ํ‰๊ฐ€ํ•˜๊ณ , ํ•„์š”์— ๋”ฐ๋ผ ์กฐ์ •ํ•ด์•ผ ํ•ฉ๋‹ˆ๋‹ค.

Decap cell์€ ์—ฌ๋Ÿฌ ์œ ์‚ฌ ๊ธฐ์ˆ ๊ณผ ๋น„๊ตํ•  ์ˆ˜ ์žˆ์œผ๋ฉฐ, ๊ฐ ๊ธฐ์ˆ ์˜ ํŠน์„ฑ, ์žฅ์  ๋ฐ ๋‹จ์ ์„ ๋ถ„์„ํ•˜๋Š” ๊ฒƒ์ด ์ค‘์š”ํ•ฉ๋‹ˆ๋‹ค.

  1. Bypass Capacitor: Bypass capacitor๋Š” decap cell๊ณผ ๋น„์Šทํ•œ ์—ญํ• ์„ ํ•˜์ง€๋งŒ, ์ผ๋ฐ˜์ ์œผ๋กœ ๋” ์ž‘์€ ์ปคํŒจ์‹œํ„ด์Šค๋ฅผ ๊ฐ–๊ณ  ์žˆ์œผ๋ฉฐ, ์ฃผ๋กœ ๊ณ ์ฃผํŒŒ ์žก์Œ ํ•„ํ„ฐ๋ง์— ์‚ฌ์šฉ๋ฉ๋‹ˆ๋‹ค. Bypass capacitor๋Š” ์ „์› ๋ ˆ์ผ์— ๊ฐ€๊นŒ์šด ์œ„์น˜์— ๋ฐฐ์น˜๋˜์–ด ์ฆ‰๊ฐ์ ์ธ ์ „์•• ๋ณ€๋™์— ๋Œ€์‘ํ•˜์ง€๋งŒ, decap cell์€ ๋” ํฐ ์šฉ๋Ÿ‰์„ ์ œ๊ณตํ•˜์—ฌ ์žฅ๊ธฐ์ ์ธ ์ „์•• ์•ˆ์ •์„ฑ์„ ๋ณด์žฅํ•ฉ๋‹ˆ๋‹ค.

  2. Power Gating: Power gating ๊ธฐ์ˆ ์€ ์ „๋ ฅ ์†Œ๋น„๋ฅผ ์ค„์ด๊ธฐ ์œ„ํ•ด ์‚ฌ์šฉ๋˜๋ฉฐ, ํŠน์ • ํšŒ๋กœ ๋ธ”๋ก์˜ ์ „์›์„ ์ฐจ๋‹จํ•˜๋Š” ๋ฐฉ์‹์ž…๋‹ˆ๋‹ค. ์ด ๊ธฐ์ˆ ์€ ์ „๋ ฅ ์†Œ๋ชจ๋ฅผ ์ค„์ด๋Š” ๋ฐ ํšจ๊ณผ์ ์ด์ง€๋งŒ, ํšŒ๋กœ๊ฐ€ ๋‹ค์‹œ ํ™œ์„ฑํ™”๋  ๋•Œ ์ „์••์˜ ์•ˆ์ •์„ฑ์„ ๋ณด์žฅํ•˜๊ธฐ ์œ„ํ•ด decap cell๊ณผ ํ•จ๊ป˜ ์‚ฌ์šฉ๋  ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค.

  3. On-Chip Inductors: On-chip inductors๋Š” ์ „๋ ฅ ๊ณต๊ธ‰์˜ ์•ˆ์ •์„ฑ์„ ๋†’์ด๋Š” ๋ฐ ๊ธฐ์—ฌํ•  ์ˆ˜ ์žˆ์œผ๋ฉฐ, decap cell๊ณผ ํ•จ๊ป˜ ์‚ฌ์šฉํ•˜์—ฌ ์ „์•• ๋ณ€๋™์„ ๋”์šฑ ํšจ๊ณผ์ ์œผ๋กœ ๊ด€๋ฆฌํ•  ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค. ๊ทธ๋Ÿฌ๋‚˜ inductors๋Š” ์ผ๋ฐ˜์ ์œผ๋กœ ๋” ํฐ ๋ฉด์ ์„ ์ฐจ์ง€ํ•˜๊ณ , ์ œ์กฐ ๊ณต์ •์ด ๋ณต์žกํ•  ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค.

๊ฐ ๊ธฐ์ˆ ์˜ ์„ ํƒ์€ ํŠน์ • ์‘์šฉ ํ”„๋กœ๊ทธ๋žจ์˜ ์š”๊ตฌ ์‚ฌํ•ญ์— ๋”ฐ๋ผ ๋‹ฌ๋ผ์ง€๋ฉฐ, ์„ค๊ณ„์ž๋Š” ์ตœ์ ์˜ ์„ฑ๋Šฅ์„ ๋‹ฌ์„ฑํ•˜๊ธฐ ์œ„ํ•ด ๋‹ค์–‘ํ•œ ๊ธฐ์ˆ ์„ ์กฐํ•ฉํ•˜์—ฌ ์‚ฌ์šฉํ•  ์ˆ˜ ์žˆ์Šต๋‹ˆ๋‹ค.

4. References

  • IEEE Solid-State Circuits Society
  • International Symposium on Low Power Electronics and Design (ISLPED)
  • Semiconductor Research Corporation (SRC)
  • TSMC (Taiwan Semiconductor Manufacturing Company)
  • GlobalFoundries

5. One-line Summary

Decap cell์€ VLSI ์‹œ์Šคํ…œ์—์„œ ์ „์•• ์•ˆ์ •์„ฑ์„ ์œ ์ง€ํ•˜๊ณ  ์ „๋ ฅ ๊ณต๊ธ‰ ๋ณ€๋™์„ ์™„ํ™”ํ•˜๋Š” ์ค‘์š”ํ•œ ์ˆ˜๋™ ์†Œ์ž๋กœ, ๋””์ง€ํ„ธ ํšŒ๋กœ ์„ค๊ณ„์— ํ•„์ˆ˜์ ์ด๋‹ค.