VLSI Korea전 세계 테이프아웃 기업 센서스 2026 — 이름으로 검증한 640개사 전체 명단
전 세계에서 실제로 tape-out 하는 회사는 몇 개일까. 이름과 증거로 검증한 640개사(Tier A 511, Tier B 129) 전체 명단과, full-mask 양산 900~1,100개사 추정 모델을 공개한다.
🆓 무료 글 · 누구나 무료로 읽을 수 있는 글입니다
Conclusion first. As of October 23, 2026, VLSI Korea estimates that 900-1,100 companies worldwide tape out full-mask chips for mass production, and 1,250-1,650 companies including MPW and shuttle tape-outs. This page is the named census behind that estimate: 640 companies verified by name (Tier A 511, Tier B 129), each with a public evidence source. Registered design companies worldwide total roughly 5,700-6,300 - most never get individually verified, and they are counted as numbers only, never as invented names.
How to read this census
- Tier A - sells a real chip product: revenue, exchange listing, or a shipping product verifies the tape-out.
- Tier B - a tape-out, MPW run, or working silicon is verified by a credible source, but mass production has not started yet.
- Tier C - registered design companies with no individually verified tape-out (for example most of the 3,626 design companies CSIA counted in China in 2024). Tier C is a statistic, not a name list.
Excluded: pure IP licensors with no chip of their own, design services with no own product, foundries, OSAT and equipment companies. Included: fabless product companies, IDM internal design organizations, and hyperscaler internal silicon teams. Anchors: TSMC reported 534 customers and 12,682 different products manufactured with 305 technologies in 2025 (522 customers in 2024). Samsung Foundry, SMIC, UMC and GlobalFoundries do not publish customer counts, which is why the non-TSMC part is an estimate range, not a fact.
Named census by country
| Country | Verified companies (Tier A+B) |
|---|---|
| China | 173 |
| United States | 147 |
| Taiwan | 97 |
| Korea | 56 |
| Japan | 33 |
| Israel | 22 |
| India | 15 |
| Canada | 10 |
| United Kingdom | 9 |
| Germany | 8 |
| Switzerland | 8 |
| France | 7 |
| Netherlands | 7 |
| Australia | 7 |
| Belgium | 5 |
| Sweden | 5 |
| Austria | 3 |
| Norway | 3 |
| Spain | 3 |
| Finland | 3 |
| Malaysia | 3 |
| Vietnam | 3 |
| Denmark | 2 |
| Brazil | 2 |
| Turkey | 2 |
| Italy | 1 |
| Portugal | 1 |
| Czechia | 1 |
| Singapore | 1 |
| Thailand | 1 |
| South Africa | 1 |
| Mexico | 1 |
| Total | 640 |
Full named list (640 companies)
Company / Country / City / Type / Segment / Status / Foundry / Evidence / Latest year / Tier. Confidence is marked per row: medium rows rely on a product page or a single announcement and are flagged for a future ticker audit.
| Company | Country | City | Type | Segment | Status | Evidence | Year | Tier |
|---|---|---|---|---|---|---|---|---|
| Analog Quantum Circuits | Australia | Brisbane | fabless | superconducting quantum chip | private | tapeout_announcement | 2024 | B |
| Archer Materials | Australia | Sydney | fabless | 12CQ quantum qubit chip | listed | listing | 2024 | B |
| Diraq | Australia | Sydney | fabless | silicon quantum dot chip | private | tapeout_announcement | 2024 | B |
| Morse Micro | Australia | Sydney | fabless | Wi-Fi HaLow SoC | private | product | 2024 | A |
| Quantum Brilliance | Australia | Canberra | fabless | diamond quantum accelerator chip | private | tapeout_announcement | 2024 | B |
| Silanna Semiconductor | Australia | Brisbane | fabless | ADC / power IC | private | product | 2024 | A |
| Silicon Quantum Computing | Australia | Sydney | fabless | silicon quantum processor chip | private | tapeout_announcement | 2024 | B |
| TTTech | Austria | Vienna | fabless | deterministic networking / automotive chips & products | private | product | 2024 | A |
| USound | Austria | Graz | fabless | MEMS speaker chip | private | product | 2024 | A |
| ams OSRAM | Austria | Premstaetten | idm_design | optical / sensor IC & LED | listed | listing | 2024 | A |
| Magics Technologies | Belgium | Leuven | fabless | radiation-hardened mixed-signal chip | private | tapeout_announcement | 2024 | B |
| Melexis | Belgium | Ypres | fabless | automotive sensor IC | listed | listing | 2024 | A |
| Pharrowtech | Belgium | Leuven | fabless | mmWave wireless chip | private | tapeout_announcement | 2024 | B |
| Spectricity | Belgium | Mechelen | fabless | multispectral image sensor | private | product | 2024 | A |
| e-peas | Belgium | Louvain-la-Neuve | fabless | energy harvesting PMIC | private | product | 2024 | A |
| CEITEC | Brazil | Porto Alegre | idm_design | RFID / IoT chips (state centre) | private | product | 2023 | B |
| Chipus Microelectronics | Brazil | Florianopolis | fabless | analog/mixed-signal IP-with-silicon | private | tapeout_announcement | 2024 | B |
| Alphawave Semi | Canada | Toronto | asic_service | high-speed connectivity chips & custom silicon | listed_parent | product | 2024 | A |
| Blumind | Canada | Vancouver | fabless | analog AI chip | private | tapeout_announcement | 2024 | B |
| Enablence Technologies | Canada | Ottawa | fabless | optical / PLC chips | listed | listing | 2024 | B |
| GaN Systems | Canada | Ottawa | fabless | GaN power transistors | listed_parent | product | 2024 | A |
| POET Technologies | Canada | Toronto | fabless | optical interposer / photonic chips | listed | listing | 2024 | B |
| Photonic Inc | Canada | Coquitlam | fabless | silicon quantum chip | private | tapeout_announcement | 2024 | B |
| Ranovus | Canada | Ottawa | fabless | optical interconnect chip (ODIN) | private | product | 2024 | A |
| Spectra7 Microsystems | Canada | Markham | fabless | analog interconnect chips | listed | listing | 2024 | A |
| Teledyne DALSA Semiconductor | Canada | Waterloo | idm_design | CMOS image sensor / MEMS | listed_parent | product | 2024 | A |
| Xanadu Quantum Technologies | Canada | Toronto | system_internal | photonic quantum chip (internal) | private | product | 2024 | B |
| 3Peak | China | Suzhou | fabless | analog_signal_chain | listed | listing | 2024 | A |
| ASR Microelectronics | China | Shanghai | fabless | baseband_SoC | listed | listing | 2024 | A |
| Actions Technology | China | Zhuhai | fabless | audio_SoC | listed | listing | 2024 | A |
| Allwinner Technology | China | Zhuhai | fabless | SoC_IoT | listed | listing | 2024 | A |
| Amicro Semiconductor | China | Zhuhai | fabless | robot_SoC | private | product | 2023 | A |
| Amlogic | China | Shanghai | fabless | SoC_TV | listed | listing | 2024 | A |
| AutoChips (Jiefa Technology) | China | Hefei | fabless | auto_MCU | private | product | 2024 | A |
| Availink | China | Beijing | fabless | demodulator_SoC | private | product | 2022 | A |
| Axera AI | China | Shanghai | fabless | edge_AI_SoC | private | product | 2024 | A |
| BIWIN Storage Technology | China | Shenzhen | fabless | memory_storage | listed | listing | 2024 | A |
| BYD Semiconductor | China | Shenzhen | idm_design | power_IGBT_MCU | private | product | 2024 | A |
| Beijing Smartchip Microelectronics | China | Beijing | fabless | industrial_SoC | private | product | 2023 | A |
| Beken Corporation | China | Shanghai | fabless | WiFi_BLE_SoC | private | product | 2024 | A |
| Bestechnic | China | Shanghai | fabless | audio_BLE_SoC | listed | listing | 2024 | A |
| Binary Semiconductor (Wuhan Erjin) | China | Wuhan | fabless | auto_MCU | private | product | 2023 | A |
| Biren Technology | China | Shanghai | fabless | AI_GPU | listed | listing | 2024 | A |
| Bitmain Technologies | China | Beijing | fabless | ASIC_mining | private | product | 2024 | A |
| Black Sesame Technologies | China | Wuhan | fabless | auto_AI_SoC | listed | listing | 2024 | A |
| Bouffalo Lab | China | Shanghai | fabless | WiFi_BLE_RISC-V_SoC | private | product | 2024 | A |
| Bright Power Semiconductor | China | Shanghai | fabless | power_IC | private | product | 2023 | A |
| ByteDance Chip Design | China | Beijing | system_internal | server_SoC | private | tapeout_announcement | 2024 | B |
| CEC Huada Electronic Design | China | Beijing | fabless | smart_card_SoC | private | product | 2023 | A |
| CRRC Times Semiconductor | China | Zhuzhou | idm_design | power_IGBT | private | product | 2024 | A |
| CXMT (ChangXin Memory) | China | Hefei | idm_design | DRAM | private | product | 2024 | A |
| Calterah Semiconductor | China | Shanghai | fabless | mmWave_radar_SoC | private | product | 2024 | A |
| Cambricon Technologies | China | Beijing | fabless | AI_accelerator | listed | listing | 2024 | A |
| Canaan Inc | China | Beijing | fabless | ASIC_mining_AI | listed | listing | 2024 | A |
| Cellwise Microelectronics | China | Shanghai | fabless | BMS_AFE | private | product | 2023 | A |
| Chengchang Technology | China | Xi'an | fabless | RF_TR_chip | listed | listing | 2024 | A |
| China Resources Microelectronics | China | Wuxi | idm_design | power_IDM | listed | listing | 2024 | A |
| Chipintelli Technology | China | Chengdu | fabless | voice_AI_chip | private | tapeout_announcement | 2023 | B |
| Chipone Technology | China | Beijing | fabless | display_driver | private | product | 2024 | A |
| Chipsea Technologies | China | Shenzhen | fabless | ADC_MCU_signal_chain | listed | listing | 2024 | A |
| Corerain Technology | China | Shenzhen | fabless | AI_accelerator | private | tapeout_announcement | 2022 | B |
| DJI Chip Design | China | Shenzhen | system_internal | drone_SoC | private | product | 2024 | A |
| Datang Microelectronics | China | Beijing | fabless | security_chip | private | product | 2023 | A |
| Denglin Technology | China | Shanghai | fabless | AI_GPGPU | private | tapeout_announcement | 2022 | B |
| Dioo Microcircuits | China | Wuxi | fabless | analog_power | listed | listing | 2024 | A |
| Dongke Semiconductor | China | Wuxi | fabless | power_LED_driver | private | product | 2023 | A |
| Dosilicon | China | Shanghai | fabless | memory_DRAM_NAND | listed | listing | 2024 | A |
| ESWIN Computing | China | Beijing | fabless | RISC-V_SoC | private | product | 2024 | A |
| Eigencomm Technology | China | Shanghai | fabless | NB-IoT_SoC | private | product | 2023 | A |
| Enflame Technology | China | Shanghai | fabless | AI_accelerator | listed | listing | 2024 | A |
| Espressif Systems | China | Shanghai | fabless | WiFi_BLE_MCU | listed | listing | 2024 | A |
| Fangcun Microelectronics | China | Hefei | fabless | GPU | private | tapeout_announcement | 2023 | B |
| Flagchip | China | Suzhou | fabless | auto_MCU | private | product | 2023 | A |
| Focuslight Technologies | China | Xi'an | idm_design | laser_optical_chip | listed | listing | 2024 | A |
| Fortior Technology | China | Shenzhen | fabless | motor_driver_MCU | listed | listing | 2024 | A |
| Fujian Jinhua Integrated Circuit | China | Jinjiang | idm_design | DRAM | private | product | 2022 | A |
| GalaxyCore | China | Shanghai | fabless | CIS_display_driver | listed | listing | 2024 | A |
| Geehy Semiconductor | China | Zhuhai | fabless | MCU | private | product | 2024 | A |
| Giantec Semiconductor | China | Shanghai | fabless | memory_EEPROM | listed | listing | 2024 | A |
| GigaDevice Semiconductor | China | Beijing | fabless | memory_MCU | listed | listing | 2024 | A |
| Global Sensor Technology | China | Wuhan | idm_design | infrared_detector | private | product | 2023 | A |
| Goodix Technology | China | Shenzhen | fabless | touch_fingerprint_sensor | listed | listing | 2024 | A |
| Gowin Semiconductor | China | Guangzhou | fabless | FPGA | private | product | 2024 | A |
| Great Microwave Technology | China | Hangzhou | fabless | RF_microwave | listed | listing | 2024 | A |
| Guobo Electronics | China | Nanjing | fabless | RF_TR_chip | listed | listing | 2024 | A |
| HDSC (Huada Semiconductor) | China | Shanghai | fabless | MCU | private | product | 2024 | A |
| Hangzhou Silan Microelectronics | China | Hangzhou | idm_design | power_IDM | listed | listing | 2024 | A |
| HiSilicon | China | Shenzhen | system_internal | SoC_AI | private | product | 2024 | A |
| Horizon Robotics | China | Beijing | fabless | auto_AI_SoC | listed | listing | 2024 | A |
| Houmo AI | China | Beijing | fabless | auto_AI_chip | private | tapeout_announcement | 2023 | B |
| Hygon Information Technology | China | Beijing | fabless | CPU_DC_accelerator | listed | listing | 2024 | A |
| Iluvatar CoreX | China | Shanghai | fabless | AI_GPU | listed | listing | 2024 | A |
| Ingenic Semiconductor | China | Beijing | fabless | SoC_MCU | listed | listing | 2024 | A |
| InnoScience | China | Suzhou | idm_design | GaN_power | listed | listing | 2024 | A |
| Innosilicon Technology | China | Wuhan | fabless | GPU_ASIC | private | product | 2023 | A |
| Intellifusion Technologies | China | Shenzhen | fabless | AI_SoC | private | tapeout_announcement | 2022 | B |
| Inventchip Technology | China | Shenzhen | fabless | SiC_GaN_driver | private | product | 2023 | A |
| JBD (Jade Bird Display) | China | Shanghai | idm_design | MicroLED_microdisplay | private | product | 2024 | A |
| JLSemi Technology | China | Shanghai | fabless | Ethernet_PHY | private | product | 2023 | A |
| Jiangsu JieJie Microelectronics | China | Nantong | idm_design | power_discrete | listed | listing | 2024 | A |
| Jilin Sino-Microelectronics | China | Jilin | idm_design | power_discrete | listed | listing | 2024 | A |
| Jingjia Microelectronics | China | Changsha | fabless | GPU | listed | listing | 2024 | A |
| JoulWatt Technology | China | Hangzhou | fabless | analog_power | listed | listing | 2024 | A |
| Kunlunxin Technology | China | Beijing | system_internal | AI_accelerator | private | product | 2024 | A |
| Li Auto Chip Design | China | Beijing | system_internal | auto_AI_chip | private | tapeout_announcement | 2025 | B |
| Linzhi Technology | China | Shanghai | fabless | ASIC_mining | private | product | 2022 | A |
| Lisuan Technology | China | Shanghai | fabless | GPU | private | tapeout_announcement | 2025 | B |
| Lontium Semiconductor | China | Hefei | fabless | interface_HDMI | private | product | 2024 | A |
| Loongson Technology | China | Beijing | fabless | CPU | listed | listing | 2024 | A |
| MEMSensing Microsystems | China | Suzhou | fabless | MEMS_sensor | private | product | 2023 | A |
| Maxic Technology | China | Beijing | fabless | power_LED_driver | listed | listing | 2024 | A |
| Maxscend Microelectronics | China | Wuxi | fabless | RF_frontend | listed | listing | 2024 | A |
| MetaX Integrated Circuits | China | Shanghai | fabless | GPU_AI | listed | listing | 2025 | A |
| MicroBT | China | Shenzhen | fabless | ASIC_mining | private | product | 2024 | A |
| MindMotion Microelectronics | China | Shanghai | fabless | MCU | private | product | 2024 | A |
| Montage Technology | China | Shanghai | fabless | memory_interface_CPU | listed | listing | 2024 | A |
| Moore Threads | China | Beijing | fabless | GPU | listed | listing | 2025 | A |
| Motorcomm Electronic Technology | China | Suzhou | fabless | Ethernet_PHY | private | product | 2024 | A |
| NIO Chip Design | China | Shanghai | system_internal | auto_AI_SoC | private | product | 2025 | A |
| Nationalchip (Hangzhou Guoxin) | China | Hangzhou | fabless | STB_SoC | private | product | 2023 | A |
| Nationz Technologies | China | Shenzhen | fabless | security_MCU | listed | listing | 2024 | A |
| Novosense Microelectronics | China | Suzhou | fabless | sensor_isolator_auto | listed | listing | 2024 | A |
| OnMicro Electronics | China | Beijing | fabless | RF_frontend | private | product | 2023 | A |
| OpenAILab | China | Shanghai | fabless | AI_accelerator | private | tapeout_announcement | 2022 | B |
| Orbbec | China | Shenzhen | fabless | 3D_sensing | listed | listing | 2024 | A |
| Oriental Semiconductor | China | Suzhou | idm_design | power_devices | private | product | 2023 | A |
| PHY Plus Microelectronics | China | Shanghai | fabless | BLE_SoC | private | product | 2023 | A |
| Pango Microelectronics | China | Shenzhen | fabless | FPGA | private | product | 2024 | A |
| Phytium Technology | China | Tianjin | fabless | CPU | private | product | 2024 | A |
| Puya Semiconductor | China | Shanghai | fabless | memory_MCU_analog | listed | listing | 2024 | A |
| QST Corporation | China | Shanghai | fabless | MEMS_IMU | private | product | 2023 | A |
| Raytron Technology | China | Yantai | fabless | infrared_MEMS_sensor | listed | listing | 2024 | A |
| Rockchip | China | Fuzhou | fabless | SoC_IoT | listed | listing | 2024 | A |
| SG Micro | China | Beijing | fabless | analog_signal_chain | listed | listing | 2024 | A |
| Sai Microelectronics | China | Beijing | fabless | MEMS_sensor | listed | listing | 2024 | A |
| Sanan Optoelectronics | China | Xiamen | idm_design | compound_LED_GaN_SiC | listed | listing | 2024 | A |
| SemiDrive Technology | China | Beijing | fabless | auto_MCU_SoC | private | product | 2024 | A |
| Semipower Technology | China | Xi'an | idm_design | power_MOSFET | private | product | 2023 | A |
| Shanghai Anlogic Infotech | China | Shanghai | fabless | FPGA | listed | listing | 2024 | A |
| Shanghai Awinic Technology | China | Shanghai | fabless | analog_audio_haptic | listed | listing | 2024 | A |
| Shanghai Belling | China | Shanghai | fabless | analog_power | listed | listing | 2024 | A |
| Shanghai Fudan Microelectronics | China | Shanghai | fabless | FPGA_security_MCU | listed | listing | 2024 | A |
| Shanghai Fullhan Microelectronics | China | Shanghai | fabless | video_SoC_ISP | listed | listing | 2024 | A |
| Shanghai Huahong Integrated Circuit | China | Shanghai | fabless | smart_card_chip | private | product | 2023 | A |
| Shanghai Panchip Microelectronics | China | Shanghai | fabless | BLE_SoC | private | product | 2023 | A |
| Shenzhen Bluetrum Technology | China | Shenzhen | fabless | audio_Bluetooth_SoC | listed | listing | 2024 | A |
| Shenzhen Longsys Electronics | China | Shenzhen | fabless | memory_storage | listed | listing | 2024 | A |
| Shenzhen Sitan Technology | China | Shenzhen | idm_design | MicroLED_chip | private | product | 2023 | B |
| Shijia Photons Technology | China | Henan | idm_design | optical_chip | listed | listing | 2024 | A |
| SiEngine Technology | China | Wuhan | fabless | auto_SoC | private | product | 2024 | A |
| SidTek | China | Xi'an | fabless | micro_OLED_driver | private | product | 2023 | A |
| SinOne Microelectronics | China | Shanghai | fabless | MCU | private | product | 2023 | A |
| Sino Wealth Electronic | China | Shanghai | fabless | MCU | listed | listing | 2024 | A |
| SmartSens Technology | China | Shanghai | fabless | CIS | listed | listing | 2024 | A |
| Smarter Microelectronics | China | Shanghai | fabless | RF_frontend | private | product | 2023 | A |
| Solomon Systech | China | Hong Kong | fabless | display_driver | listed | listing | 2024 | A |
| Sophgo | China | Shenzhen | fabless | SoC_RISC-V_AI | private | product | 2024 | A |
| Southchip Semiconductor | China | Shanghai | fabless | power_charging | listed | listing | 2024 | A |
| SpacemiT | China | Zhuhai | fabless | RISC-V_CPU_SoC | private | product | 2024 | A |
| StarFive Technology | China | Shanghai | fabless | RISC-V_SoC | private | product | 2023 | A |
| StarPower Semiconductor | China | Jiaxing | idm_design | power_IGBT_module | listed | listing | 2024 | A |
| SuperPix Microelectronics | China | Beijing | fabless | CIS | private | product | 2022 | A |
| Suzhou Centec Communications | China | Suzhou | fabless | Ethernet_switch_chip | listed | listing | 2024 | A |
| Suzhou Everbright Photonics | China | Suzhou | idm_design | laser_diode_chip | listed | listing | 2024 | A |
| Suzhou Good-Ark Electronics | China | Suzhou | idm_design | power_discrete | listed | listing | 2024 | A |
| T-Head Semiconductor | China | Hangzhou | system_internal | CPU_AI_SoC | private | product | 2024 | A |
| Telink Semiconductor | China | Shanghai | fabless | BLE_SoC | private | product | 2024 | A |
| Tencent Chip Design | China | Shenzhen | system_internal | AI_video_DPU | private | tapeout_announcement | 2023 | B |
| ThinkForce | China | Shanghai | fabless | AI_SoC | private | tapeout_announcement | 2022 | B |
| Thinkon Semiconductor | China | Jinzhou | idm_design | power_discrete | listed | listing | 2024 | A |
| Unigroup Guoxin Microelectronics | China | Beijing | fabless | FPGA_security_memory | listed | listing | 2024 | A |
| Unisoc | China | Shanghai | fabless | baseband_SoC | private | product | 2024 | A |
| Unisound | China | Beijing | fabless | voice_AI_chip | private | tapeout_announcement | 2023 | B |
| Vanchip Technology | China | Tianjin | fabless | RF_frontend | listed | listing | 2024 | A |
| Vastai Technology | China | Shanghai | fabless | AI_accelerator | private | tapeout_announcement | 2022 | B |
| VeriSilicon Microelectronics | China | Shanghai | asic_service | ASIC_IP_plus_design_service | listed | listing | 2024 | A |
| Viewtrix Technology | China | Shenzhen | fabless | OLED_display_driver | private | product | 2023 | A |
| Vivo Chip Design | China | Dongguan | system_internal | ISP_SoC | private | product | 2024 | A |
| WCH (Nanjing Qinheng Microelectronics) | China | Nanjing | fabless | RISC-V_MCU_USB | private | product | 2024 | A |
| Will Semiconductor (OmniVision) | China | Shanghai | fabless | CIS_display | listed | listing | 2024 | A |
| WuQi Microelectronics | China | Shanghai | fabless | TWS_audio_SoC | private | product | 2023 | A |
| Wuhan Guide Infrared | China | Wuhan | idm_design | infrared_sensor | listed | listing | 2024 | A |
| Wuxi Chipown Micro-electronics | China | Wuxi | fabless | power_ACDC | listed | listing | 2024 | A |
| Wuxi NCE Power | China | Wuxi | idm_design | power_MOSFET_IGBT | listed | listing | 2024 | A |
| X-Powers Technology | China | Zhuhai | fabless | PMIC | private | product | 2023 | A |
| XPeng Chip Design | China | Guangzhou | system_internal | auto_AI_chip | private | product | 2025 | A |
| XTX Technology | China | Shenzhen | fabless | NOR_flash_memory | private | product | 2024 | A |
| Xiangdixian Computing | China | Chengdu | fabless | GPU | private | tapeout_announcement | 2023 | B |
| Xiaomi Pinecone (XRing) | China | Beijing | system_internal | SoC | private | product | 2025 | A |
| Xinrui Technology | China | Shenzhen | fabless | power_IC | private | product | 2022 | A |
| YMTC (Yangtze Memory) | China | Wuhan | idm_design | NAND_flash | private | product | 2024 | A |
| YTMicro (Yuntu Microelectronics) | China | Shenzhen | fabless | auto_MCU | private | product | 2023 | A |
| Yangzhou Yangjie Electronic Technology | China | Yangzhou | idm_design | power_discrete | listed | listing | 2024 | A |
| Yuanjie Semiconductor | China | Xi'an | idm_design | optical_laser_chip | listed | listing | 2024 | A |
| ZTE Microelectronics (Sanechips) | China | Shenzhen | system_internal | comms_SoC | private | product | 2024 | A |
| Zbit Semiconductor | China | Hefei | fabless | memory | private | product | 2023 | A |
| Zhaoxin Semiconductor | China | Shanghai | fabless | CPU_x86 | private | product | 2024 | A |
| Zhejiang Dali Technology | China | Hangzhou | idm_design | infrared_sensor | listed | listing | 2024 | A |
| Zhuhai Jieli Technology | China | Zhuhai | fabless | Bluetooth_audio_SoC | private | product | 2024 | A |
| iRay Technology | China | Shanghai | fabless | infrared_Xray_detector | listed | listing | 2024 | A |
| Tropic Square | Czechia | Prague | fabless | secure element chip (TROPIC01) | private | product | 2025 | A |
| Demant Semiconductor | Denmark | Smorum | system_internal | hearing-aid chip (internal, Oticon) | listed_parent | product | 2024 | A |
| GN Hearing Semiconductor | Denmark | Ballerup | system_internal | hearing-aid chip (internal) | listed_parent | tapeout_announcement | 2024 | B |
| IQM Quantum Computers | Finland | Espoo | system_internal | superconducting quantum processor (internal) | private | product | 2024 | B |
| SemiQon | Finland | Espoo | fabless | silicon quantum processor chip | private | tapeout_announcement | 2024 | B |
| Vaisala Semiconductor | Finland | Vantaa | system_internal | sensor chips (internal) | listed_parent | product | 2024 | A |
| GreenWaves Technologies | France | Grenoble | fabless | RISC-V AI processor (GAP9) | private | product | 2024 | A |
| Insight SiP | France | Sophia Antipolis | fabless | RF system-in-package / BLE modules with own RF IC | private | product | 2024 | A |
| Kalray | France | Grenoble | fabless | DPU / data processing unit | listed | listing | 2024 | A |
| Prophesee | France | Paris | fabless | event-based vision sensor chip (with Sony) | private | product | 2024 | A |
| Sequans Communications | France | Paris | fabless | cellular IoT SoC (LTE-M / NB-IoT) | listed | listing | 2024 | A |
| SiPearl | France | Maisons-Laffitte | fabless | HPC microprocessor (Rhea) | private | tapeout_announcement | 2025 | B |
| VSORA | France | Paris | fabless | AI inference accelerator | private | tapeout_announcement | 2024 | B |
| Black Semiconductor | Germany | Aachen | fabless | graphene photonics interconnect chip | private | tapeout_announcement | 2024 | B |
| Bosch Semiconductor | Germany | Reutlingen | system_internal | automotive MEMS / power / ASIC (internal) | listed_parent | product | 2024 | A |
| Elmos Semiconductor | Germany | Dortmund | fabless | automotive ASIC / sensor IC | listed | listing | 2024 | A |
| Ferroelectric Memory Company (FMC) | Germany | Dresden | fabless | FeFET non-volatile memory | private | tapeout_announcement | 2024 | B |
| First Sensor | Germany | Berlin | idm_design | pressure / optical sensor IC | listed_parent | product | 2024 | A |
| Infineon Technologies | Germany | Munich | idm_design | power / automotive / MCU | listed | listing | 2024 | A |
| Q.ANT | Germany | Stuttgart | fabless | photonic processor chip | private | product | 2024 | B |
| SpiNNcloud Systems | Germany | Dresden | fabless | neuromorphic supercomputing chip | private | tapeout_announcement | 2024 | B |
| Aura Semiconductor | India | Bengaluru | fabless | timing / power / RF chips | private | product | 2024 | A |
| BigEndian Semiconductors | India | Bengaluru | fabless | surveillance / vision SoC | private | tapeout_announcement | 2025 | B |
| C2i Semiconductors | India | Bengaluru | fabless | power delivery chip for data centres | private | tapeout_announcement | 2025 | B |
| FermionIC Design | India | Bengaluru | fabless | analog / RF IC | private | tapeout_announcement | 2024 | B |
| Mindgrove Technologies | India | Chennai | fabless | secure IoT SoC (RISC-V Shakti-based) | private | tapeout_announcement | 2024 | B |
| Morphing Machines | India | Bengaluru | fabless | RISC-V many-core processor | private | tapeout_announcement | 2024 | B |
| MosChip Technologies | India | Hyderabad | asic_service | turnkey ASIC & own semiconductor products | listed | listing | 2024 | A |
| Netrasemi | India | Thiruvananthapuram | fabless | edge AI SoC | private | tapeout_announcement | 2025 | B |
| Primus Semiconductors | India | Noida | fabless | advanced SoC (JV design company) | private | tapeout_announcement | 2025 | B |
| Saankhya Labs | India | Bengaluru | fabless | SDR / D2M broadcast SoC | listed_parent | product | 2024 | A |
| Sensesemi Technologies | India | Bengaluru | fabless | healthcare / IoT SoC chips | private | tapeout_announcement | 2024 | B |
| Signalchip | India | Bengaluru | fabless | 4G/5G baseband SoC (Agumbe) | private | tapeout_announcement | 2023 | B |
| Siliconch Systems | India | Bengaluru | fabless | power / charger controller IC | private | product | 2024 | A |
| Terminus Circuits | India | Bengaluru | fabless | high-speed interconnect chip/IP-with-silicon | private | tapeout_announcement | 2024 | B |
| Vervesemi Microelectronics | India | Noida | fabless | analog / mixed-signal IC | private | tapeout_announcement | 2024 | B |
| Arbe Robotics | Israel | Tel Aviv | fabless | 4D imaging radar chipset | listed | listing | 2024 | A |
| Autotalks | Israel | Kfar Neter | fabless | V2X chipset | listed_parent | product | 2024 | A |
| ColorChip | Israel | Yokneam | fabless | optical transceiver chip | private | product | 2024 | A |
| DustPhotonics | Israel | Modiin | fabless | optical interconnect chip | private | product | 2024 | A |
| Hailo | Israel | Tel Aviv | fabless | edge AI accelerator (Hailo-8/10/15) | listed_parent | product | 2024 | A |
| Innoviz Technologies | Israel | Rosh HaAyin | fabless | LiDAR sensor & SoC | listed | listing | 2024 | A |
| Mobileye | Israel | Jerusalem | fabless | ADAS SoC (EyeQ) | listed | listing | 2024 | A |
| NeuReality | Israel | Caesarea | fabless | AI inference chip (NR1) | private | tapeout_announcement | 2024 | B |
| Newsight Imaging | Israel | Ness Ziona | fabless | CMOS image sensor chip | private | product | 2024 | A |
| Opsys Technologies | Israel | Holon | fabless | solid-state LiDAR sensor chip/system | private | tapeout_announcement | 2024 | B |
| Pliops | Israel | Ramat Gan | fabless | storage / data processor chip | private | product | 2024 | A |
| Quantum Transistors | Israel | Tel Aviv | fabless | silicon quantum chip | private | tapeout_announcement | 2024 | B |
| Ramon Chips | Israel | Haifa | fabless | radiation-hardened space processor | private | product | 2024 | A |
| RunEL | Israel | Rishon LeZion | fabless | 5G / OpenRAN SoC | private | tapeout_announcement | 2024 | B |
| SatixFy | Israel | Rehovot | fabless | satellite communication chips | listed | listing | 2024 | A |
| Speedata | Israel | Tel Aviv | fabless | analytics processing unit chip | private | tapeout_announcement | 2024 | B |
| TriEye | Israel | Tel Aviv | fabless | SWIR image sensor chip | private | product | 2024 | A |
| Valens Semiconductor | Israel | Hod Hasharon | fabless | HDBaseT / MIPI A-PHY automotive chipset | listed | listing | 2024 | A |
| Vayyar Imaging | Israel | Yehud | fabless | 4D imaging radar-on-chip | private | product | 2024 | A |
| Weebit Nano | Israel | Hod Hasharon | fabless | ReRAM memory IP-with-silicon / memory | listed | listing | 2024 | B |
| Wiliot | Israel | Caesarea | fabless | battery-free BLE IoT Pixel tag chip | private | product | 2024 | A |
| Xsight Labs | Israel | Kiryat Gat | fabless | networking / SmartSwitch SoC | private | tapeout_announcement | 2024 | B |
| Eggtronic | Italy | Modena | fabless | wireless power conversion IC | private | product | 2024 | A |
| ABLIC | Japan | Tokyo | fabless | analog / power / sensor IC | listed_parent | product | 2024 | A |
| ArchiTek | Japan | Osaka | fabless | AI edge processor | private | tapeout_announcement | 2023 | B |
| Asahi Kasei Microdevices (AKM) | Japan | Tokyo | system_internal | analog / magnetic sensor IC (group fabless-IDM) | listed_parent | product | 2024 | A |
| DENSO Semiconductor | Japan | Kariya | system_internal | automotive power / ASIC (internal) | listed | product | 2024 | A |
| Digital Media Professionals (DMP) | Japan | Tokyo | fabless | AI processor / GPU SoC (plus IP licensing) | listed | listing | 2024 | A |
| EdgeCortix | Japan | Tokyo | fabless | edge AI accelerator | private | tapeout_announcement | 2024 | A |
| FLOSFIA | Japan | Kyoto | idm_design | gallium oxide power devices (Kyoto Univ spin-out) | private | tapeout_announcement | 2024 | B |
| Fuji Electric Semiconductor | Japan | Tokyo | idm_design | power semiconductors (IGBT / SiC) | listed | listing | 2024 | A |
| Hamamatsu Photonics Semiconductor | Japan | Hamamatsu | idm_design | optical semiconductor detectors / image sensors | listed | listing | 2024 | A |
| Kioxia | Japan | Tokyo | idm_design | NAND flash memory | listed | listing | 2024 | A |
| LAPIS Technology | Japan | Yokohama | fabless | low-power MCU / display driver / RF LSI (ROHM group) | listed_parent | product | 2024 | A |
| MIRISE Technologies | Japan | Nisshin | system_internal | automotive SoC / power R&D (Toyota-DENSO JV) | private | tapeout_announcement | 2024 | B |
| MegaChips | Japan | Osaka | fabless | LSI for displays / communications / automotive | listed | listing | 2024 | A |
| Mitsubishi Electric Semiconductor | Japan | Tokyo | system_internal | power modules / high-power devices (internal division) | listed_parent | product | 2024 | A |
| Nichia | Japan | Tokushima | idm_design | LED / laser diode chips | private | product | 2024 | A |
| Nisshinbo Micro Devices | Japan | Tokyo | fabless | analog IC (ex-Ricoh Electronic Devices) | listed_parent | product | 2024 | A |
| Nuvoton Technology Japan | Japan | Kyoto | idm_design | MCU / image sensor / laser / GaN (ex-Panasonic Semiconductor) | listed_parent | product | 2024 | A |
| PEZY Computing | Japan | Tokyo | fabless | many-core processor for supercomputers | private | tapeout_announcement | 2023 | A |
| Preferred Networks | Japan | Tokyo | fabless | AI accelerator (MN-Core) | private | tapeout_announcement | 2024 | A |
| ROHM | Japan | Kyoto | idm_design | analog / power / discrete LSI | listed | listing | 2025 | A |
| Ramxeed | Japan | Kawasaki | fabless | FRAM / non-volatile memory IC (Fujitsu group) | listed_parent | product | 2024 | A |
| Renesas Electronics | Japan | Tokyo | idm_design | MCU / SoC / analog / power | listed | listing | 2025 | A |
| Sanken Electric | Japan | Niiza | idm_design | power IC / motor driver / discrete | listed | listing | 2024 | A |
| Seiko Epson Semiconductor | Japan | Suwa | system_internal | MCU / display controller / ASIC (internal division) | listed_parent | product | 2024 | A |
| Sharp Semiconductor | Japan | Sakai | system_internal | LSI for displays / sensors (internal division) | listed_parent | product | 2023 | B |
| Shindengen Electric | Japan | Tokyo | idm_design | diodes / power modules / car electronics devices | listed | listing | 2024 | A |
| Socionext | Japan | Yokohama | asic_service | custom SoC / Solution SoC design | listed | listing | 2026 | A |
| Sony Semiconductor Solutions | Japan | Atsugi | system_internal | CMOS image sensors (group IDM) | listed_parent | product | 2025 | A |
| THine Electronics | Japan | Tokyo | fabless | high-speed interface / image processing LSI | listed | listing | 2024 | A |
| TRIPLE-1 | Japan | Fukuoka | fabless | cryptocurrency mining ASIC | private | tapeout_announcement | 2023 | B |
| Torex Semiconductor | Japan | Tokyo | fabless | analog power management IC | listed | listing | 2024 | A |
| Toshiba Electronic Devices & Storage | Japan | Tokyo | idm_design | discrete / power / logic LSI / HDD SoC | private | product | 2024 | A |
| Trigence Semiconductor | Japan | Tokyo | fabless | digital audio (Dnote) / power IC | private | product | 2023 | A |
| 3ALogics | Korea | Seongnam | fabless | NFC / UHF RFID reader chips | private | product | 2024 | A |
| ABOV Semiconductor | Korea | Cheongju | fabless | MCU / touch / motor control | listed | listing | 2024 | A |
| ADTechnology | Korea | Suwon | asic_service | Samsung Foundry design solution partner (DSP) | listed | listing | 2024 | A |
| AUK Corp | Korea | Gwangju | idm_design | discrete semiconductor devices | listed | listing | 2023 | A |
| Ajin Xtek | Korea | Daegu | fabless | motion control chip / module | listed | listing | 2023 | A |
| AnaPass | Korea | Seoul | fabless | mobile display interface / T-Con | listed | listing | 2024 | A |
| BOS Semiconductors | Korea | Seongnam | fabless | automotive AI SoC | private | tapeout_announcement | 2025 | B |
| Barun Electronics | Korea | Seoul | fabless | flash memory application / controller IC | listed | listing | 2023 | B |
| Bitsensing | Korea | Seoul | fabless | imaging radar chips / radar SoC development | private | tapeout_announcement | 2024 | B |
| CoAsia | Korea | Incheon | asic_service | Samsung Foundry design solution partner (DSP) | listed | listing | 2024 | A |
| Coreriver | Korea | Seongnam | fabless | MCU / touch / display IC | private | product | 2023 | A |
| DB HiTek | Korea | Bucheon | idm_design | analog / power / BCD (foundry plus own-design products) | listed | listing | 2024 | A |
| DEEPX | Korea | Seongnam | fabless | on-device AI NPU | private | tapeout_announcement | 2025 | A |
| Daeml Multimedia | Korea | Seongnam | fabless | functional / optical IC design | listed | listing | 2023 | B |
| Dongwoon Anatech | Korea | Seoul | fabless | camera AF driver IC / OIS / PMIC | listed | listing | 2024 | A |
| Eyenix | Korea | Suwon | fabless | image signal processor (ISP) chips | private | product | 2024 | A |
| FADU | Korea | Seoul | fabless | SSD controller / data-center IC | listed | listing | 2026 | A |
| FuriosaAI | Korea | Seoul | fabless | AI inference accelerator (NPU) | private | tapeout_announcement | 2025 | A |
| GAONCHIPS | Korea | Seongnam | asic_service | Samsung Foundry design solution partner (DSP) | listed | listing | 2024 | A |
| Haechitech | Korea | Seoul | fabless | 3D ToF sensor IC | private | tapeout_announcement | 2023 | B |
| HyperAccel | Korea | Seoul | fabless | LLM processing unit (LPU) | private | tapeout_announcement | 2024 | B |
| Hyundai Mobis Semiconductor Lab | Korea | Yongin | system_internal | automotive power / control semiconductors (internal) | listed_parent | tapeout_announcement | 2024 | B |
| I&C Technology | Korea | Seongnam | fabless | Wi-Fi / PLC / connectivity chips | listed | listing | 2024 | A |
| ImageNEXT | Korea | Seoul | fabless | automotive vision / camera SoC | private | product | 2023 | B |
| Jeju Semiconductor | Korea | Jeju | fabless | low-power memory / MCP | listed | listing | 2024 | A |
| KEC | Korea | Seoul | idm_design | discrete / power / small-signal devices | listed | listing | 2024 | A |
| LG Electronics System IC Center | Korea | Seoul | system_internal | TV / appliance SoC (internal) | listed_parent | product | 2024 | A |
| LX Semicon | Korea | Daejeon | fabless | display driver IC / T-Con / PMIC | listed | listing | 2025 | A |
| Magnachip Semiconductor | Korea | Seoul | idm_design | DDI / power (own Cheongju fab) | listed | listing | 2024 | A |
| MangoBoost | Korea | Seoul | fabless | data processing unit (DPU) | private | tapeout_announcement | 2024 | B |
| Maple Semiconductor | Korea | Seoul | fabless | SiC power devices | private | product | 2023 | B |
| Memray | Korea | Seoul | fabless | CXL memory controller / expansion IC | private | tapeout_announcement | 2024 | B |
| Mobilint | Korea | Seoul | fabless | edge AI NPU | private | product | 2024 | A |
| MtekVision | Korea | Seongnam | fabless | image processing / camera SoC design | listed | listing | 2023 | A |
| Nextchip | Korea | Seongnam | fabless | automotive image signal processor / ADAS SoC | listed | listing | 2024 | A |
| Panmnesia | Korea | Daejeon | fabless | CXL switch / fabric chip (KAIST spin-out) | private | tapeout_announcement | 2024 | B |
| Pixelplus | Korea | Suwon | fabless | CMOS image sensor / ISP | listed | listing | 2024 | A |
| Point2 Technology | Korea | Seoul | fabless | optical interconnect / e-Tube RF interconnect chips | private | product | 2024 | A |
| PowerCubeSemi | Korea | Cheongju | fabless | SiC / GaN power semiconductor design | private | product | 2024 | B |
| PowerLSI | Korea | Cheongju | fabless | power / system semiconductor IC | private | tapeout_announcement | 2023 | B |
| RFsemi | Korea | Daejeon | idm_design | ECM chip / TVS diode devices | listed | listing | 2023 | A |
| Raontech | Korea | Seongnam | fabless | microdisplay (LCoS) controller / SoC | listed | listing | 2024 | A |
| Rebellions | Korea | Seongnam | fabless | AI inference accelerator (NPU) | private | tapeout_announcement | 2025 | A |
| SEMIFIVE | Korea | Seongnam | asic_service | platform-based custom SoC / AI ASIC design | listed | listing | 2025 | A |
| SK hynix | Korea | Icheon | idm_design | DRAM / NAND / CIS (memory IDM) | listed | filing | 2025 | A |
| Samsung System LSI | Korea | Suwon | system_internal | mobile SoC / CIS / DDI | listed_parent | product | 2025 | A |
| Sapien Semiconductor | Korea | Seoul | fabless | microLED display driver IC | private | tapeout_announcement | 2024 | B |
| Seoul Semiconductor | Korea | Ansan | idm_design | LED chips / opto semiconductor | listed | listing | 2024 | A |
| SolidVue | Korea | Seongnam | fabless | LiDAR sensor SoC | private | tapeout_announcement | 2024 | B |
| Supergate | Korea | Seoul | fabless | AI / SoC design | private | tapeout_announcement | 2023 | B |
| TLi Inc | Korea | Seongnam | fabless | timing controller (T-Con) for displays | listed | listing | 2023 | A |
| Telechips | Korea | Seoul | fabless | automotive cockpit / AP SoC | listed | listing | 2024 | A |
| XCENA | Korea | Seoul | fabless | CXL memory controller / smart memory | private | tapeout_announcement | 2025 | B |
| YES Power Technix | Korea | Pohang | idm_design | SiC power semiconductor devices (own fab) | private | product | 2024 | A |
| i3system | Korea | Daejeon | idm_design | infrared / X-ray image sensors | listed | listing | 2024 | A |
| iA Inc | Korea | Seoul | fabless | automotive semiconductor / motor control ASIC | listed | listing | 2024 | A |
| IC Microsystems | Malaysia | Cyberjaya | fabless | mixed-signal IC | private | product | 2024 | A |
| Key ASIC | Malaysia | Petaling Jaya | fabless | IoT / ASIC chips | listed | listing | 2024 | A |
| SkyeChip | Malaysia | Penang | fabless | edge AI processor | private | tapeout_announcement | 2024 | B |
| QSM Semiconductors | Mexico | Queretaro | fabless | semiconductor design / first Mexican chips | private | tapeout_announcement | 2024 | B |
| Ampleon | Netherlands | Nijmegen | fabless | RF power transistors | private | product | 2024 | A |
| Axelera AI | Netherlands | Eindhoven | fabless | edge AI accelerator (Metis) | private | product | 2024 | A |
| Effect Photonics | Netherlands | Eindhoven | fabless | coherent optical DSP SoC | private | product | 2024 | A |
| NXP Semiconductors | Netherlands | Eindhoven | idm_design | automotive / secure edge MCU & MPU | listed | listing | 2024 | A |
| Nexperia | Netherlands | Nijmegen | idm_design | discrete / logic / power devices | listed_parent | product | 2024 | A |
| PhotonFirst | Netherlands | Alkmaar | fabless | integrated photonics sensing chips | private | tapeout_announcement | 2024 | B |
| WeEn Semiconductors | Netherlands | Nijmegen | idm_design | power discrete devices | private | product | 2024 | A |
| Nordic Semiconductor | Norway | Trondheim | fabless | BLE / cellular IoT SoC (nRF series) | listed | listing | 2024 | A |
| Novelda | Norway | Oslo | fabless | UWB radar sensor chip | private | product | 2024 | A |
| ONiO | Norway | Oslo | fabless | energy-harvesting MCU | private | tapeout_announcement | 2024 | B |
| Picadvanced | Portugal | Aveiro | fabless | optical transceiver chip | private | tapeout_announcement | 2024 | B |
| Zero-Error Systems | Singapore | Singapore | fabless | radiation-hardened IC | private | tapeout_announcement | 2024 | B |
| Azoteq | South Africa | Paarl | fabless | proximity / touch sensor IC | private | product | 2024 | A |
| Farsens | Spain | San Sebastian | fabless | battery-free RFID sensor chips | private | product | 2024 | A |
| KDPOF | Spain | Madrid | fabless | automotive optical Ethernet IC | private | product | 2024 | A |
| Openchip | Spain | Barcelona | fabless | RISC-V HPC / AI SoC | private | tapeout_announcement | 2025 | B |
| Acconeer | Sweden | Malmo | fabless | 60GHz pulsed radar sensor chip | listed | listing | 2024 | A |
| Fingerprint Cards | Sweden | Gothenburg | fabless | fingerprint sensor IC | listed | listing | 2024 | A |
| Imsys | Sweden | Uppsala | fabless | microprocessor / SoC | listed | listing | 2024 | A |
| Neonode | Sweden | Stockholm | fabless | optical sensing / zForce chip products | listed | listing | 2024 | A |
| Sivers Semiconductors | Sweden | Kista | fabless | RF / photonic laser chips | listed | listing | 2024 | A |
| EM Microelectronic | Switzerland | Marin | fabless | ultra-low-power IC / RFID | listed_parent | product | 2024 | A |
| Espros Photonics | Switzerland | Sargans | fabless | 3D TOF image sensor chip | private | product | 2024 | A |
| ID Quantique | Switzerland | Geneva | fabless | quantum photonics detector chips/products | private | product | 2024 | B |
| STMicroelectronics | Switzerland | Geneva | idm_design | MCU / power / MEMS / analog | listed | listing | 2024 | A |
| Sensirion | Switzerland | Staefa | idm_design | environmental sensor IC | listed | listing | 2024 | A |
| Sonova Semiconductor | Switzerland | Staefa | system_internal | hearing-aid SoC (internal) | listed_parent | product | 2024 | A |
| Synthara | Switzerland | Zurich | fabless | in-memory computing chip | private | tapeout_announcement | 2024 | B |
| u-blox | Switzerland | Thalwil | fabless | GNSS & cellular positioning chips/modules | listed | listing | 2024 | A |
| ALi Corporation | Taiwan | Taipei | fabless | set-top box and multimedia SoC | listed | filing | 2024 | A |
| AP Memory Technology | Taiwan | Zhubei | fabless | IoT RAM and PSRAM | listed | filing | 2025 | A |
| ASIX Electronics | Taiwan | Hsinchu | fabless | Ethernet and USB controller | listed | filing | 2024 | A |
| ASMedia Technology | Taiwan | Taipei | fabless | USB and PCIe controller | listed | filing | 2025 | A |
| ASPEED Technology | Taiwan | Hsinchu | fabless | BMC and server management SoC | listed | filing | 2025 | A |
| Advanced Analog Technology | Taiwan | Taipei | fabless | power management and motor driver | listed | filing | 2024 | A |
| Advanced Power Electronics (APEC) | Taiwan | Hsinchu | idm_design | power discrete and power IC | listed | filing | 2024 | A |
| Airoha Technology | Taiwan | Hsinchu | fabless | Bluetooth and broadband SoC | listed | filing | 2025 | A |
| Alchip Technologies | Taiwan | Taipei | asic_service | ASIC design service | listed | filing | 2025 | A |
| Alcor Micro | Taiwan | New Taipei | fabless | USB and card reader controller | listed | filing | 2024 | A |
| Amazing Microelectronic | Taiwan | Taipei | fabless | ESD protection and interface | listed | filing | 2024 | A |
| Analog Integrations | Taiwan | Hsinchu | fabless | analog and power management | listed | filing | 2024 | A |
| Anpec Electronics | Taiwan | Hsinchu | fabless | power management and motor driver | listed | filing | 2025 | A |
| Appro Technology | Taiwan | Hsinchu | fabless | surveillance and multimedia SoC | private | product | 2023 | A |
| C-Media Electronics | Taiwan | Taipei | fabless | audio codec and USB audio | listed | filing | 2024 | A |
| Capella Microsystems | Taiwan | Taipei | fabless | optical sensor | private_subsidiary | filing | 2023 | A |
| Champion Microelectronic | Taiwan | Hsinchu | fabless | power management controller | listed | filing | 2023 | A |
| Davicom Semiconductor | Taiwan | Hsinchu | fabless | Ethernet controller | listed | filing | 2023 | A |
| ELAN Microelectronics | Taiwan | Hsinchu | fabless | touchpad and MCU and fingerprint | listed | filing | 2025 | A |
| ENE Technology | Taiwan | Hsinchu | fabless | embedded controller and keyboard controller | listed | filing | 2024 | A |
| EcoNet | Taiwan | Hsinchu | fabless | broadband and PON SoC | private_subsidiary | product | 2024 | A |
| Egis Technology | Taiwan | Taipei | fabless | fingerprint sensor | listed | filing | 2025 | A |
| Elite Semiconductor (ESMT) | Taiwan | Hsinchu | fabless | DRAM and memory | listed | filing | 2024 | A |
| Etron Technology | Taiwan | Hsinchu | fabless | DRAM and USB controller | listed | filing | 2024 | A |
| Excelliance MOS | Taiwan | Hsinchu | fabless | power management and MOSFET driver | listed | filing | 2024 | A |
| Faraday Technology | Taiwan | Hsinchu | asic_service | ASIC design service | listed | filing | 2025 | A |
| Feature Integration Technology (Fintek) | Taiwan | Hsinchu | fabless | Super I/O and hardware monitor | listed | filing | 2024 | A |
| Fitipower Integrated Technology | Taiwan | Hsinchu | fabless | display driver and power management | listed | filing | 2024 | A |
| FocalTech Systems | Taiwan | Zhubei | fabless | touch and display driver | listed | filing | 2025 | A |
| Fortemedia | Taiwan | Taipei | fabless | audio DSP and voice processor | private | product | 2023 | A |
| Generalplus Technology | Taiwan | Hsinchu | fabless | MCU and multimedia SoC | listed | filing | 2024 | A |
| Genesys Logic | Taiwan | New Taipei | fabless | USB controller and hub | listed | filing | 2024 | A |
| Global Mixed-mode Technology (GMT) | Taiwan | Hsinchu | fabless | analog and power management | listed | filing | 2024 | A |
| Global Unichip (GUC) | Taiwan | Hsinchu | asic_service | ASIC design service | listed | filing | 2025 | A |
| Grain Media | Taiwan | Hsinchu | fabless | surveillance SoC | private | product | 2023 | B |
| Himax Technologies | Taiwan | Tainan | fabless | display driver and timing controller | listed | filing | 2025 | A |
| Holtek Semiconductor | Taiwan | Hsinchu | fabless | MCU | listed | filing | 2025 | A |
| IC Plus | Taiwan | Hsinchu | fabless | Ethernet controller and switch | listed | filing | 2024 | A |
| ITE Tech | Taiwan | Hsinchu | fabless | PC I/O and HDMI and embedded controller | listed | filing | 2025 | A |
| ITH Corporation | Taiwan | Hsinchu | fabless | display driver | listed | filing | 2024 | A |
| Ili Technology (Ilitek) | Taiwan | Hsinchu | fabless | display driver | listed | filing | 2024 | A |
| InPsytech | Taiwan | Hsinchu | asic_service | ASIC design service | private | product | 2023 | B |
| JMicron Technology | Taiwan | Hsinchu | fabless | storage and USB bridge controller | listed | filing | 2024 | A |
| King Billion Electronics | Taiwan | Hsinchu | fabless | MCU and memory controller | private | product | 2023 | A |
| Kneron | Taiwan | Taipei | fabless | AI accelerator SoC | private | product | 2024 | A |
| Leadtrend Technology | Taiwan | Taipei | fabless | power management controller | listed | filing | 2024 | A |
| MStar Semiconductor | Taiwan | Zhubei | fabless | TV and monitor SoC | private_subsidiary | product | 2024 | A |
| Macroblock | Taiwan | Taipei | fabless | LED driver | listed | filing | 2024 | A |
| Macronix International | Taiwan | Hsinchu | idm_design | NOR flash and ROM | listed | filing | 2025 | A |
| MediaTek | Taiwan | Hsinchu | fabless | mobile SoC and connectivity | listed | filing | 2025 | A |
| Megawin Technology | Taiwan | Taipei | fabless | MCU | listed | filing | 2023 | A |
| Mosel Vitelic | Taiwan | Hsinchu | idm_design | memory and power MOSFET | listed | filing | 2024 | A |
| Myson Century | Taiwan | Hsinchu | fabless | multimedia and monitor SoC | listed | filing | 2024 | A |
| Nanya Technology | Taiwan | Taoyuan | idm_design | DRAM | listed | filing | 2025 | A |
| Neuchips | Taiwan | Hsinchu | fabless | AI accelerator | private | tapeout_announcement | 2024 | B |
| Niko Semiconductor | Taiwan | Taipei | fabless | power management and MOSFET | listed | filing | 2024 | A |
| Novatek Microelectronics | Taiwan | Hsinchu | fabless | display driver and SoC | listed | filing | 2025 | A |
| Nuvoton Technology | Taiwan | Hsinchu | fabless | MCU and audio SoC | listed | filing | 2025 | A |
| Nyquest Technology | Taiwan | Zhubei | fabless | voice and MCU SoC | listed | filing | 2024 | A |
| Orise Technology | Taiwan | Hsinchu | fabless | display driver | private_subsidiary | filing | 2023 | A |
| Padauk Technology | Taiwan | Hsinchu | fabless | MCU | listed | filing | 2024 | A |
| Pan Jit International | Taiwan | Kaohsiung | idm_design | diode and power discrete | listed | filing | 2024 | A |
| Parade Technologies | Taiwan | Taipei | fabless | display interface and USB retimer | listed | filing | 2025 | A |
| Phison Electronics | Taiwan | Zhubei | fabless | NAND flash controller | listed | filing | 2025 | A |
| PixArt Imaging | Taiwan | Hsinchu | fabless | CMOS image sensor and optical navigation | listed | filing | 2025 | A |
| Power Forest Technology | Taiwan | Hsinchu | fabless | power management and motor driver | listed | filing | 2024 | A |
| Princeton Technology | Taiwan | Taipei | fabless | multimedia and display and remote IC | listed | filing | 2024 | A |
| ProMOS Technologies | Taiwan | Hsinchu | idm_design | DRAM | listed | filing | 2023 | A |
| Prolific Technology | Taiwan | Taipei | fabless | USB and serial controller | listed | filing | 2024 | A |
| RDC Semiconductor | Taiwan | Hsinchu | fabless | x86 SoC and graphics | listed | filing | 2024 | A |
| Rafael Microelectronics | Taiwan | Hsinchu | fabless | RF tuner and broadband front-end | listed | filing | 2024 | A |
| Raydium Semiconductor | Taiwan | Hsinchu | fabless | display driver and touch | listed | filing | 2025 | A |
| Realtek Semiconductor | Taiwan | Hsinchu | fabless | networking and multimedia SoC | listed | filing | 2025 | A |
| Richtek Technology | Taiwan | Zhubei | fabless | power management | private_subsidiary | filing | 2024 | A |
| S3 Graphics | Taiwan | Taipei | fabless | GPU and graphics processor | private_subsidiary | product | 2022 | B |
| Sensortek Technology | Taiwan | Zhubei | fabless | optical and proximity sensor | listed | filing | 2024 | A |
| Silergy Corp | Taiwan | Taipei | fabless | analog and power management | listed | filing | 2024 | A |
| Silicon Integrated Systems (SiS) | Taiwan | Hsinchu | fabless | chipset and multimedia SoC | listed | filing | 2024 | A |
| Silicon Motion Technology | Taiwan | Taipei | fabless | NAND flash controller | listed | filing | 2025 | A |
| Sinopower Semiconductor | Taiwan | Hsinchu | idm_design | power MOSFET and power IC | listed | filing | 2024 | A |
| Sitronix Technology | Taiwan | Zhubei | fabless | display driver | listed | filing | 2025 | A |
| Skymedi Corporation | Taiwan | Hsinchu | fabless | flash storage controller | private | product | 2023 | A |
| Solid State System (3S) | Taiwan | Hsinchu | fabless | NAND flash controller | listed | filing | 2024 | A |
| Sonix Technology | Taiwan | Taipei | fabless | MCU and multimedia SoC | listed | filing | 2024 | A |
| Sunplus Technology | Taiwan | Hsinchu | fabless | multimedia and LCD SoC | listed | filing | 2024 | A |
| Taiwan Semiconductor Co (TSC) | Taiwan | New Taipei | idm_design | discrete and power semiconductor | listed | filing | 2024 | A |
| Tenx Technology | Taiwan | Hsinchu | fabless | MCU | listed | filing | 2023 | A |
| VIA Labs | Taiwan | New Taipei | fabless | USB hub and PD controller | private_subsidiary | product | 2024 | A |
| VIA Technologies | Taiwan | New Taipei | fabless | x86 and embedded SoC | listed | filing | 2024 | A |
| Weltrend Semiconductor | Taiwan | Hsinchu | fabless | MCU and power and surveillance SoC | listed | filing | 2024 | A |
| Winbond Electronics | Taiwan | Taichung | idm_design | DRAM and flash memory | listed | filing | 2025 | A |
| WonderMedia Technologies | Taiwan | Taipei | fabless | ARM multimedia SoC | private_subsidiary | product | 2023 | A |
| ZillTek Technology | Taiwan | Hsinchu | fabless | MEMS microphone and sensor | listed | filing | 2024 | A |
| eEver Technology | Taiwan | Hsinchu | fabless | USB PD and Type-C controller | private_subsidiary | product | 2024 | A |
| eYs3D Microelectronics | Taiwan | Taipei | fabless | stereo vision and depth processor | private | product | 2024 | A |
| iCatch Technology | Taiwan | Hsinchu | fabless | image signal processor SoC | listed | filing | 2024 | A |
| uPI Semiconductor | Taiwan | Zhubei | fabless | power management | listed | filing | 2024 | A |
| Silicon Craft Technology | Thailand | Bangkok | fabless | RFID / NFC IC | listed | listing | 2024 | A |
| ASELSAN Semiconductor | Turkey | Ankara | system_internal | defence ASIC / GaN chips (internal) | listed_parent | product | 2024 | A |
| YongaTek Microelectronics | Turkey | Istanbul | fabless | RISC-V MCU | private | tapeout_announcement | 2024 | B |
| Bridgetek (FTDI) | United Kingdom | Glasgow | fabless | USB / display controller IC (FTDI chips) | private | product | 2024 | A |
| Cambridge GaN Devices | United Kingdom | Cambridge | fabless | GaN power IC (ICeGaN) | private | product | 2024 | A |
| EnSilica | United Kingdom | Abingdon | asic_service | ASIC design & supply (own ASIC products) | listed | listing | 2024 | A |
| FlexEnable | United Kingdom | Cambridge | fabless | flexible OTFT display / sensor chips | private | tapeout_announcement | 2024 | B |
| Flusso | United Kingdom | Cambridge | fabless | flow sensor chip | listed_parent | product | 2024 | A |
| Forefront RF | United Kingdom | Cambridge | fabless | RF front-end chip | private | tapeout_announcement | 2024 | B |
| Plessey Semiconductors | United Kingdom | Plymouth | idm_design | GaN-on-Si microLED / sensor devices | private | product | 2024 | A |
| Pragmatic Semiconductor | United Kingdom | Cambridge | idm_design | flexible IC (FlexIC NFC) | private | product | 2024 | A |
| XMOS | United Kingdom | Bristol | fabless | xcore voice / MCU processors | private | product | 2024 | A |
| Abbott Laboratories | United States | Abbott Park | system_internal | biosensor ASICs for FreeStyle Libre - captive | listed_parent | filing | 2024 | A |
| Achronix Semiconductor | United States | Santa Clara | fabless | high-end FPGA (Speedster7t) + eFPGA | private | product | 2024 | A |
| Advanced Micro Devices (AMD) | United States | Santa Clara | fabless | CPU / GPU / FPGA (Xilinx) / AI accelerator | listed | filing | 2025 | A |
| Aeva Technologies | United States | Mountain View | fabless | FMCW lidar-on-chip (silicon photonics SoC) | listed | filing | 2025 | A |
| Allegro MicroSystems | United States | Manchester | fabless | magnetic sensor and power ICs | listed | filing | 2025 | A |
| Alpha and Omega Semiconductor | United States | Sunnyvale | fabless | power MOSFET / power IC | listed | filing | 2025 | A |
| Altera | United States | San Jose | fabless | FPGA (former Intel PSG; 51% Silver Lake from Sep 2025) | private | tapeout_announcement | 2025 | A |
| Amazon Annapurna Labs | United States | Austin | system_internal | Graviton CPU / Trainium AI / Nitro - captive to AWS | listed_parent | product | 2025 | A |
| Ambarella | United States | Santa Clara | fabless | edge AI vision SoC | listed | filing | 2025 | A |
| Ampere Computing | United States | Santa Clara | fabless | Arm server CPU | private | tapeout_announcement | 2025 | A |
| Analog Devices | United States | Wilmington | idm_design | analog / mixed-signal / DSP - IDM | listed | filing | 2025 | A |
| Anokiwave | United States | San Diego | fabless | mmWave phased-array ICs (acquired by Qorvo 2024) | private | tapeout_announcement | 2024 | A |
| Apple (Apple Silicon) | United States | Cupertino | system_internal | in-house SoC for iPhone / Mac / wearables - captive only | listed_parent | filing | 2025 | A |
| Applied Optoelectronics | United States | Sugar Land | idm_design | laser diodes and optical transceiver ICs - IDM | listed | filing | 2025 | A |
| Astera Labs | United States | Santa Clara | fabless | PCIe / CXL connectivity and retimers for AI servers | listed | filing | 2025 | A |
| Avicena Tech | United States | Sunnyvale | fabless | microLED optical interconnect chip (LightBundle) | private | tapeout_announcement | 2024 | B |
| Ayar Labs | United States | San Jose | fabless | optical I/O chiplet (TeraPHY) + SuperNova light source | private | tapeout_announcement | 2024 | B |
| Blaize | United States | El Dorado Hills | fabless | graph-streaming edge AI processor | listed | filing | 2024 | A |
| Broadcom | United States | Palo Alto | fabless | custom AI ASIC (asic_service for hyperscalers) / networking / wireless | listed | filing | 2025 | A |
| Celestial AI | United States | Santa Clara | fabless | Photonic Fabric optical interconnect chiplet (acquired by Marvell Feb 2026) | private | tapeout_announcement | 2025 | B |
| Cerebras Systems | United States | Sunnyvale | fabless | wafer-scale AI accelerator (WSE) | private | tapeout_announcement | 2024 | A |
| Chipletz | United States | Austin | fabless | Smart Substrate chiplet platform | private | tapeout_announcement | 2023 | B |
| Ciena | United States | Hanover | system_internal | WaveLogic coherent DSP ASICs - captive to own optical systems | listed_parent | filing | 2024 | A |
| Cirrus Logic | United States | Austin | fabless | audio codec / haptics / mixed-signal | listed | filing | 2025 | A |
| Cisco (Silicon One) | United States | San Jose | system_internal | Silicon One routing/switching ASIC - captive + merchant systems | listed_parent | product | 2025 | A |
| Coherent | United States | Saxonburg | idm_design | InP lasers / silicon photonics / optical semiconductors - IDM | listed | filing | 2025 | A |
| Cornelis Networks | United States | Wayne | fabless | Omni-Path fabric switch/NIC ASICs (Intel spinout) | private | tapeout_announcement | 2025 | A |
| Credo Technology | United States | San Jose | fabless | SerDes / active electrical cables / line-card ICs | listed | filing | 2025 | A |
| Dexcom | United States | San Diego | system_internal | CGM sensor ASICs - captive to own medical devices | listed_parent | filing | 2023 | A |
| Diodes Incorporated | United States | Plano | idm_design | discrete / analog ICs - mixed own fab | listed | filing | 2025 | A |
| DreamBig Semiconductor | United States | San Jose | fabless | chiplet platform / accelerator SoC on Samsung SF4X | private | tapeout_announcement | 2024 | B |
| EMCORE | United States | Alhambra | idm_design | InP chips / fiber-optic gyros and photonics - IDM | listed | filing | 2024 | A |
| EdgeQ | United States | Santa Clara | fabless | 5G base-station-on-a-chip SoC with AI | private | tapeout_announcement | 2024 | B |
| Efficient Computer | United States | Pittsburgh | fabless | energy-efficient general-purpose processor (Efficium) | private | tapeout_announcement | 2025 | A |
| Efficient Power Conversion (EPC) | United States | El Segundo | fabless | GaN power transistors/ICs (eGaN) | private | product | 2024 | A |
| Efinix | United States | Santa Clara | fabless | FPGA (Titanium / Trion Quantum architecture) | private | product | 2024 | A |
| Eliyan | United States | Santa Clara | fabless | chiplet PHY interconnect (NuLink) - silicon-proven PHY/chiplets | private | tapeout_announcement | 2024 | B |
| EnCharge AI | United States | Princeton | fabless | analog in-memory AI accelerator | private | tapeout_announcement | 2024 | B |
| Enfabrica | United States | Mountain View | fabless | ACF-S network fabric chip for AI clusters (NVIDIA deal Sep 2025) | private | tapeout_announcement | 2024 | A |
| Enphase Energy | United States | Fremont | system_internal | microinverter ASICs - captive to own power systems | listed_parent | filing | 2024 | A |
| Esperanto Technologies | United States | Mountain View | fabless | RISC-V manycore AI inference chip (ET-SoC-1) | private | tapeout_announcement | 2021 | B |
| Etched | United States | San Jose | fabless | transformer-only ASIC (Sohu) | private | tapeout_announcement | 2024 | B |
| Everspin Technologies | United States | Chandler | fabless | MRAM memory ICs (fabless with own backend) | listed | filing | 2025 | A |
| Finwave Semiconductor | United States | Waltham | fabless | GaN / 3D GaN FinFET devices | private | tapeout_announcement | 2023 | B |
| GSI Technology | United States | Sunnyvale | fabless | SRAM and associative processing (APU) | listed | filing | 2024 | A |
| General Motors (Cruise silicon) | United States | Detroit | system_internal | in-house autonomy SoC program for Cruise/ADAS - captive | listed_parent | tapeout_announcement | 2024 | B |
| Google (TPU / Tensor) | United States | Mountain View | system_internal | TPU AI accelerator and Tensor SoC - captive to Google Cloud / Pixel | listed_parent | product | 2025 | A |
| Groq | United States | Mountain View | fabless | LPU inference accelerator (note: NVIDIA licensing/acquihire deal Dec 2025) | private | tapeout_announcement | 2024 | A |
| Hewlett Packard Enterprise (incl. Juniper) | United States | Houston | system_internal | Cray Slingshot interconnect ASIC and Juniper Trio/Express ASICs - captive | listed_parent | filing | 2025 | A |
| Honeywell | United States | Charlotte | idm_design | sensor ASICs / MEMS and microelectronics for own systems - IDM heritage fabs | listed | filing | 2024 | A |
| IBM | United States | Armonk | idm_design | mainframe / Power processors and AI accelerators - IDM heritage | listed | filing | 2025 | A |
| IPG Photonics | United States | Marlborough | idm_design | fiber laser diodes and amplifiers - IDM | listed | filing | 2025 | A |
| Illumina | United States | San Diego | system_internal | CMOS sensors / flow-cell silicon for sequencers - captive | listed_parent | filing | 2024 | A |
| Intel | United States | Santa Clara | idm_design | CPU / GPU / FPGA (Altera legacy) - IDM with own fabs | listed | filing | 2025 | A |
| InvenSense | United States | San Jose | fabless | MEMS IMU / microphone sensors (design arm of TDK) | private | product | 2024 | A |
| IonQ | United States | College Park | idm_design | trapped-ion quantum processors (chip-based ion traps) | listed | filing | 2025 | A |
| Kinara | United States | Los Gatos | fabless | edge AI processor (Ara-1 / Ara-2) | private | product | 2023 | A |
| Knowles | United States | Itasca | idm_design | MEMS microphone dies - IDM | listed | filing | 2025 | A |
| Kopin | United States | Westborough | idm_design | microdisplay chips (OLED/LCD on silicon) | listed | filing | 2025 | A |
| L3Harris Technologies | United States | Melbourne | idm_design | defense ASICs / microelectronics for own radios and systems | listed | filing | 2024 | A |
| Lattice Semiconductor | United States | Hillsboro | fabless | low-power FPGA | listed | filing | 2025 | A |
| Lightmatter | United States | Mountain View | fabless | photonic interconnect (Passage) and photonic compute (Envise) | private | tapeout_announcement | 2025 | B |
| Littelfuse | United States | Chicago | idm_design | power semiconductors / SiC / protection devices - mixed own fab | listed | filing | 2025 | A |
| Lumentum | United States | San Jose | idm_design | optical / photonic chips for datacom and sensing - IDM | listed | filing | 2025 | A |
| MACOM Technology Solutions | United States | Lowell | fabless | RF / microwave / optical ICs | listed | filing | 2025 | A |
| Marvell Technology | United States | Santa Clara | fabless | custom ASIC (asic_service) / networking / optical DSP / storage controllers | listed | filing | 2025 | A |
| MaxLinear | United States | Carlsbad | fabless | broadband / networking / PAM4 DSP SoC | listed | filing | 2025 | A |
| MemryX | United States | Ann Arbor | fabless | edge AI accelerator (MX3) | private | tapeout_announcement | 2024 | A |
| Menlo Microsystems | United States | Irvine | fabless | MEMS switch chips (Ideal Switch) | private | product | 2024 | A |
| Meta (MTIA) | United States | Menlo Park | system_internal | MTIA AI inference/training accelerator - captive only | listed_parent | tapeout_announcement | 2025 | A |
| Micro Magic | United States | Sunnyvale | fabless | high-performance RISC-V core prototype silicon | private | tapeout_announcement | 2020 | B |
| MicroVision | United States | Redmond | fabless | MEMS scanning mirror ASICs for lidar | listed | filing | 2024 | A |
| Microchip Technology | United States | Chandler | idm_design | MCU / analog / FPGA (PolarFire) - mixed own fab and foundry | listed | filing | 2025 | A |
| Micron Technology | United States | Boise | idm_design | DRAM / NAND / HBM memory - IDM | listed | filing | 2025 | A |
| Microsoft (Maia / Cobalt) | United States | Redmond | system_internal | Maia AI accelerator and Cobalt CPU - captive to Azure | listed_parent | product | 2025 | A |
| Monolithic Power Systems | United States | Kirkland | fabless | power management ICs | listed | filing | 2025 | A |
| Movandi | United States | Irvine | fabless | mmWave phased-array / RF ICs for 5G | private | product | 2023 | A |
| Mythic | United States | Austin | fabless | analog in-flash AI processor (M1076) | private | tapeout_announcement | 2022 | A |
| NVIDIA | United States | Santa Clara | fabless | GPU / AI accelerator / networking (incl. custom silicon) | listed | filing | 2025 | A |
| Navitas Semiconductor | United States | Torrance | fabless | GaN and SiC power ICs | listed | filing | 2025 | A |
| Neuralink | United States | Fremont | system_internal | N1 implant ASIC - captive to own BCI device | private | product | 2024 | A |
| Neurophos | United States | Austin | fabless | optical computing unit (photonic AI chip) | private | tapeout_announcement | 2025 | B |
| Normal Computing | United States | New York | fabless | thermodynamic computing ASIC (physics-based) | private | tapeout_announcement | 2025 | B |
| Northrop Grumman | United States | Falls Church | idm_design | defense microelectronics / MMICs in own fabs - captive | listed | filing | 2024 | A |
| OpenAI (Jalapeno) | United States | San Francisco | system_internal | custom LLM inference accelerator with Broadcom - captive | private | tapeout_announcement | 2026 | B |
| OpenFive | United States | San Jose | asic_service | custom SoC / chiplet design services with customer tape-outs | private | product | 2024 | A |
| OpenLight Photonics | United States | Santa Barbara | fabless | photonic ASICs (PASIC) with integrated lasers | private | tapeout_announcement | 2023 | B |
| Ouster | United States | San Francisco | fabless | digital lidar SPAD/ASIC - custom silicon in own sensors | listed | filing | 2024 | A |
| Pacific Biosciences | United States | Menlo Park | system_internal | SMRT Cell CMOS sensor chips - captive to own sequencers | listed_parent | filing | 2024 | A |
| Paradromics | United States | Austin | system_internal | Connexus BCI ASIC/array - captive to own device | private | tapeout_announcement | 2025 | B |
| Peraso | United States | San Jose | fabless | 60GHz mmWave ICs | listed | filing | 2024 | A |
| Pivotal Commware | United States | Bothell | system_internal | Holographic Beam Forming array silicon for 5G repeaters - captive/system | private | tapeout_announcement | 2023 | B |
| Pixelworks | United States | Portland | fabless | video / display processing ICs | listed | filing | 2025 | A |
| Positron AI | United States | Reno | fabless | memory-first inference accelerator (Atlas fabbed by Intel Foundry) | private | tapeout_announcement | 2025 | A |
| Power Integrations | United States | San Jose | fabless | high-voltage power conversion ICs (GaN) | listed | filing | 2025 | A |
| PsiQuantum | United States | Palo Alto | fabless | photonic quantum chipset (Omega) fabbed at GlobalFoundries | private | tapeout_announcement | 2025 | B |
| Qorvo | United States | Greensboro | idm_design | RF / power / sensing ICs - mixed own fab | listed | filing | 2025 | A |
| Qualcomm | United States | San Diego | fabless | mobile SoC / RF / automotive / IoT (incl. RISC-V via Ventana) | listed | filing | 2025 | A |
| QuickLogic | United States | San Jose | fabless | ultra-low-power FPGA / eFPGA-based SoC | listed | filing | 2024 | A |
| RTX (Raytheon Microelectronics) | United States | Arlington | idm_design | GaAs/GaN MMICs in own Andover fab - captive defense systems | listed | filing | 2024 | A |
| Rambus | United States | San Jose | fabless | memory interface chips (register/RCD/MRCD) - note: now sells chips not only IP | listed | filing | 2025 | A |
| Recogni | United States | San Jose | fabless | automotive / inference AI accelerator (Scorpio) | private | tapeout_announcement | 2023 | B |
| Rigetti Computing | United States | Berkeley | idm_design | superconducting quantum processors - own Fab-1 | listed | filing | 2025 | A |
| Rivian | United States | Irvine | system_internal | RAP1 autonomy platform SoC (with Arm) - captive to own vehicles | listed_parent | tapeout_announcement | 2025 | B |
| Rivos | United States | Santa Clara | fabless | RISC-V server / AI inference SoC - acquired by Meta (2025) | private | tapeout_announcement | 2025 | B |
| SambaNova Systems | United States | Palo Alto | fabless | reconfigurable dataflow unit (RDU) for AI | private | tapeout_announcement | 2024 | A |
| SanDisk | United States | Milpitas | idm_design | NAND flash and SSD - IDM (spun out of Western Digital 2025) | listed | filing | 2025 | A |
| Seagate Technology | United States | Fremont | system_internal | HDD controller SoC - captive to own drives | listed_parent | filing | 2025 | A |
| Semtech | United States | Camarillo | fabless | analog / LoRa / optical interconnect ICs | listed | filing | 2025 | A |
| Sensata Technologies | United States | Attleboro | idm_design | MEMS pressure / force sensor dies - mixed own fab | listed | filing | 2025 | A |
| Si-Ware Systems | United States | Menlo Park | fabless | MEMS spectral sensor chips (NeoSpectra) | private | product | 2023 | A |
| SiLC Technologies | United States | Monrovia | fabless | FMCW lidar-on-chip (Eyeonic) | private | product | 2023 | A |
| SiMa.ai | United States | San Jose | fabless | edge MLSoC (Modalix) | private | tapeout_announcement | 2025 | A |
| SiTime | United States | Santa Clara | fabless | MEMS timing oscillators | listed | filing | 2025 | A |
| Silicon Labs | United States | Austin | fabless | wireless IoT SoC / MCU | listed | filing | 2025 | A |
| Skorpios Technologies | United States | Albuquerque | fabless | silicon photonics ICs for optical modules | private | product | 2023 | A |
| Skyworks Solutions | United States | Irvine | fabless | RF front-end modules and ICs | listed | filing | 2025 | A |
| Solidigm | United States | Rancho Cordova | idm_design | NAND SSD with in-house controllers/firmware (SK hynix subsidiary) | private | product | 2024 | A |
| SpaceX (Starlink silicon) | United States | Hawthorne | system_internal | custom phased-array / Starlink ASICs - captive only | private | tapeout_announcement | 2024 | B |
| Synaptics | United States | San Jose | fabless | touch / display driver / IoT SoC | listed | filing | 2025 | A |
| Syntiant | United States | Irvine | fabless | neural decision processors for always-on edge AI | private | product | 2024 | A |
| Tagore Technology | United States | Arlington Heights | fabless | GaN / RF switch and front-end ICs | private | product | 2024 | A |
| Tarana Wireless | United States | Milpitas | system_internal | custom ASICs for Gigabit fixed-wireless (G1) - captive | private | tapeout_announcement | 2023 | A |
| Teledyne Technologies | United States | Thousand Oaks | idm_design | CMOS/CCD image sensors (Teledyne DALSA/e2v US ops) | listed | filing | 2025 | A |
| Tenstorrent | United States | Santa Clara | fabless | AI accelerator + RISC-V CPU (per brief: US HQ counted; founded Toronto) | private | product | 2025 | A |
| Tesla (FSD / Dojo silicon) | United States | Austin | system_internal | FSD autonomy SoC and Dojo training tile - captive only | listed_parent | tapeout_announcement | 2025 | A |
| Texas Instruments | United States | Dallas | idm_design | analog / embedded processing - IDM with own 300mm fabs | listed | filing | 2025 | A |
| Trimble | United States | Westminster | system_internal | custom GNSS receiver ASICs - captive to own positioning products | listed_parent | filing | 2024 | A |
| Uhnder | United States | Austin | fabless | digital radar-on-chip for automotive/industrial | private | tapeout_announcement | 2023 | A |
| Ventana Micro Systems | United States | Cupertino | fabless | RISC-V CPU chiplet (Veyron) - acquired by Qualcomm Dec 2025 | private | tapeout_announcement | 2024 | B |
| Vesper Technologies | United States | Boston | fabless | piezoelectric MEMS microphones | private | product | 2023 | A |
| Vicor | United States | Andover | idm_design | power converter chips/modules (ChiP) - IDM | listed | filing | 2025 | A |
| Vishay Intertechnology | United States | Malvern | idm_design | discrete semiconductors / MOSFET / diodes - IDM | listed | filing | 2025 | A |
| Voyant Photonics | United States | New York | fabless | FMCW lidar-on-a-chip | private | tapeout_announcement | 2024 | B |
| Waymo | United States | Mountain View | system_internal | custom compute and lidar silicon for Waymo Driver - captive | listed_parent | tapeout_announcement | 2024 | B |
| Western Digital | United States | San Jose | idm_design | HDD and storage systems with in-house controller ASICs | listed | filing | 2025 | A |
| Wolfspeed | United States | Durham | idm_design | SiC power devices and materials - IDM | listed | filing | 2025 | A |
| Xconn Technologies | United States | San Jose | fabless | PCIe / CXL switch chip | private | tapeout_announcement | 2023 | B |
| Xscape Photonics | United States | New York | fabless | silicon photonics platform for AI interconnect (Chromosapphire) | private | tapeout_announcement | 2024 | B |
| Zadar Labs | United States | Pittsburgh | fabless | imaging radar-on-chip | private | tapeout_announcement | 2023 | B |
| d-Matrix | United States | Santa Clara | fabless | in-memory-compute AI inference chip (Corsair) | private | tapeout_announcement | 2024 | A |
| eInfochips | United States | San Jose | asic_service | ASIC design and silicon engineering services (Arrow subsidiary) | private | product | 2024 | A |
| indie Semiconductor | United States | Aliso Viejo | fabless | automotive SoC / sensing / photonics ICs | listed | filing | 2025 | A |
| nLIGHT | United States | Camas | idm_design | semiconductor lasers - IDM | listed | filing | 2025 | A |
| onsemi | United States | Scottsdale | idm_design | power / sensing semiconductors - IDM | listed | filing | 2025 | A |
| pSemi | United States | San Diego | fabless | RF SOI switches / front-end ICs (Murata subsidiary) | private | product | 2024 | A |
| xMEMS Labs | United States | Santa Clara | fabless | MEMS microspeaker and micro-cooling chips | private | product | 2024 | A |
| FPT Semiconductor | Vietnam | Hanoi | fabless | power management / IoT chips | listed_parent | product | 2024 | A |
| VNChip | Vietnam | Ho Chi Minh City | fabless | chip design / first products | private | tapeout_announcement | 2024 | B |
| Viettel High Tech | Vietnam | Hanoi | system_internal | 5G / defence chips (internal) | listed_parent | product | 2024 | B |
Method and limits
The global estimate is built independently of this name list: TSMC customers (534, fact) plus unique-only customers of other foundries (+280-420, estimate, after removing an assumed 35-50% multi-foundry overlap) plus IDM internal-only design organizations (+60-100, estimate) equals 874-1,054, rounded to 900-1,100. A company using two foundries is counted once. The largest uncertainty is the other-foundry add-on, because those foundries do not disclose customer counts. This is v1.1 (October 2026) and will be updated as more regions and private companies are verified.
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매일 10:30 Daily Silicon과 실적·IB 리포트 핵심 해설을 가장 먼저 보내드립니다. 삼성전자·SK하이닉스·TSMC·HBM 수급까지, 현직 엔지니어 관점으로 정리합니다. 이미 300명 이상이 받고 있습니다.
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