Search published article titles and excerpts here, or choose a wider Google search.
Analysis
Trump's August 2026 OGE transaction report, released October 8: AMD sold for M-M, Micron net sold, Nvidia a modest net buy, and a M-5M Meta purchase. Every semiconductor trade, organized.
Analysis
TSMC Q3 2026 revenue of US$46.72B, net income up 68.7%, 2nm at 8% of wafer revenue and Q4 guidance of US$52.3-54.3B — 18 facts verified from the official release and earnings call.
Analysis
Eliyan sells the wires between chiplets: 64 Gbps per bump on standard organic packaging, a cap table spanning Intel, Samsung, SK hynix, AMD, Arm and Meta, a $1B Series C — and a reported $3B takeover question. The full deep dive.
Analysis
Chipletz began inside AMD in 2016 and spun out in 2021. CEO Bryan Black ran the die-stacking program behind Fiji, the first HBM product. Its Smart Substrate deletes the interposer and cut an HBM design from 16 metal layers to 9. SKC owns ~12%. Demo taped out; no production customer yet.
Analysis
Major global fabs are forecast at about 91% average utilization in Q4 2026, while 8-inch capacity fell 6% this year and 55/90nm prices keep rising. UMC climbed from 79% to 85% in one quarter. Why the AI boom is tightening old nodes first.
Analysis
Helium spot prices tripled in 2026 and a third of world supply is trapped behind the Hormuz closure. Chips consume a fifth of the world's helium, and one US fab says 40-50% of its tools use it. Why a minor cost line became a binary production risk.
Analysis
The AI bottleneck has moved down to MLCCs and substrates: 32-week MLCC lead times vs 12 normal, FC-BGA at 48-56 weeks, Samsung Electro-Mechanics Q3 consensus operating profit up 134%, LTAs with 10 hyperscalers and over 70% of substrate expansion customer-financed.
Analysis
EDA and IP revenue hit USD 5,710.8M in Q2 2026, up 12.2%. IP took about 38.5% of the total at USD 2,199.0M, APAC grew 22.4%, and headcount fell 1.6%. What the design boom's structure says about wafer demand 12-18 months out.
Analysis
TSMC is adding a fourth 3nm site in Tainan, targeting H1 2028, while 3nm is already 33% of wafer revenue. When demand exceeds supply for years, capacity itself becomes the moat.
Daily
Chip stocks snapped an 8-day slide with a 1.9% rebound on October 19, JPMorgan upgraded Intel, TSMC added a Tainan 3nm fab, EDA revenue hit $5.7 billion, and Lam Research earnings loom — 8 reads for October 20.
Analysis
Micron's Taiwan union is not on strike - it holds a strike mandate and a one-day walkout set for Oct 22. The demand: 15% of operating profit, shared permanently. Plus Samsung's 10.5% formula, SK hynix's 25-vote rejection, and TSMC's 30% bonus defense: the full 2026 chip strike map.
Analysis
As AI packages outgrow ABF cores on warpage, glass-core substrates move from research to a qualification race. Timelines for Intel, TSMC, SEMCO, Absolics and LG Innotek, the TGV engineering hurdles, and Korea's display-glass edge.
VLSI Korea