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Career
Foundry pay cannot be ranked in one list. Intel's $217K hardware median, TSMC's NT$3.05M, and Samsung's KRW 130M company-wide average are different definitions, compared in labeled panels, never mixed.
Career
Only three fabless companies pay Senior engineers above $300K in the US: Apple $366K, Broadcom $335K, NVIDIA $324K. Senior Software and Hardware rankings plus NVIDIA's SW vs HW gap, from Levels.fyi medians.
Analysis
ASE's packaging and test (ATM) revenue rose 51.0% year over year in Q3 2026 to US$4.74 billion, outpacing group growth of 44.8%. ASE lifted 2026 capex to US$10.5 billion and Amkor guided Q3 sales higher. The back end is scaling with the front end.
Analysis
Nomura's Oct 19 global memory report says memory demand will outpace supply at least through 2028. It maintained Buy on Samsung Electronics (KRW 670,000 target) and SK hynix (KRW 4.7 million) as stocks to watch.
Analysis
ByteDance, Alibaba and Tencent ordered over 3 million RTX PRO 5500 cards worth over USD 35 billion, but Nvidia may fill only 5-10%. China orders top 6 million against a 3 million 2027 cap, with Rubin first in line for capacity.
Analysis
SKKU's Cerberus won a Best Paper Award at ISCA 2026. Its Encode-Once, Decode-Many co-design unifies on-die, link, and system ECC into one shared redundancy, cutting HBM overhead 33.3% while raising reliability. We break down the method, the numbers, and the limits.
Analysis
Micron is funding mineral refining in New York: strategic funding for Indium Corporation's Rome expansion, part of the up-to-USD 3B U.S. supply-chain plan, with a long-term supply agreement still planned, not signed. The USD 250B+ fab program is separate.
Analysis
DRAM used for 5-6 years is being desoldered in Huaqiangbei and reused for another 5-6 years. Some phone makers are reportedly reviewing it; no adoption is confirmed. The economics of a shortage-built shadow chain.
Analysis
Advanced packaging passes 50% of the OSAT market in 2026, yet capacity runs 10-20% short of demand even as TSMC scales CoWoS to 120k-140k wafers per month. When packaging is the bottleneck, pricing power moves downstream.
Daily
On October 20 the KOSPI fell 3.73% with Samsung and SK hynix down together. Lam Research and Texas Instruments earnings previews, TSMC's $23B Japan 3nm plan, and the Samsung-TSMC NVHBM tie-up — 8 reads for October 21.
Analysis
Japan funds up to USD 21 billion while GlobalFoundries operates two new Malta fabs. We break down the deal structure, the CHIPS reallocation and US equity stake, the US fab investment comparison, and the demand risk.
Analysis
Samsung led Mistral AI's EUR 3 billion Series D on Sep 8, 2026, and will integrate Mistral Large across its semiconductor operations on-premise. This deep dive explains why the data boundary, not the model, is the story, and what 1 point of yield is worth.
VLSI Korea