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Analysis
Microsoft unveiled Maia 300, its third-generation custom AI chip, and plans to deploy over a million in 2027. The world's biggest GPU buyer is becoming a GPU competitor — and token economics, not FLOPS, is the new battleground.
Analysis
South Korea's ₩1.6 quadrillion AI plan is still a plan: factories, power, talent, and water must arrive together. KIET sees three bottlenecks — advanced packaging, data-center power, robotics — where Korea can be the essential supplier. Goals: 2x HBM/DRAM in 5 years, 8.4 GW by 2029, 18.4 GW by 2035.
Analysis
Micron opened HBM packaging plant AATT2 in Taichung on Oct 15, 2026, declaring 2027 capacity sold out — evidence the AI chip bottleneck moved from wafers to advanced packaging. VLSI+MBA analysis: demand vs execution risks, the $600M patent settlement, Taiwan concentration paradox.
Analysis
SK Hynix and Samsung unveiled HBM4E side by side at SEDEX 2026. Specs are tied — the real contest is who defines the post-HBM memory hierarchy. 3D stacked DRAM and HBF vs HBM5, custom HBM, CXL and PIM: who captures the next decade of AI memory economics.
Daily
Samsung +2.38%, SK Hynix +2.69% rebound; foreigners net-sold KRW 91 trillion of SK Hynix this year; HBM4E (16Gb/s per pin) unveiled; Micron's AATT2 opens in Taichung; TSMC supply bottleneck; conventional DRAM shortage ahead. 8 semiconductor stories and the stocks roundup for October 17.
Analysis
Qualcomm's CEO declared the agentic age on Sep 23, 2026: the 20-year app era is ending as AI agents act on your behalf. A 100B-parameter on-device phone targets 2028 — but memory bandwidth and power walls stand in the way. What the LPDDR6 race means for memory.
Analysis
The real bottleneck in AI accelerator supply is not chips but ABF substrates. A data-driven look at Unimicron's NT$53.7B expansion and TWD 10.09B Hukou acquisition, SEMCO's KRW 6.78T bet, Ibiden's 2.5x plan, what the 11.6%-to-24.8% margin surge signals, and where Korea's substrate cluster stands.
Analysis
TSMC held 2026 capex at $60-64B while lifting revenue growth guidance to ~44%, and ASML posted record Q3 results while warning 2027-2028 capacity cannot meet demand — with 2029-2030 orders already discussed. How the shortage moved from chips to fab tools, winners and losers, and the Korea angle.
Analysis
Morgan Stanley: the easy money is past for memory. Samsung and SK Hynix at 3-4x forward P/E may be a valuation trap — after a 9x rally and +432% EPS revisions, further upside needs DRAM prices +70%. New capacity from 2H27 is the swing variable. Based on secondary coverage.
Analysis
TSMC posted record Q3 results: NT$1.49T in revenue, net income up 68.7% to NT$763B. 2nm jumped to 8% of wafer revenue in one quarter; HPC now accounts for 68% of total revenue. The CEO declared demand still exceeds supply. The numbers prove the AI chip cycle's bottleneck is supply, not demand.
Analysis
SK Hynix has reportedly made its US NAND fab conditional on Washington approving US chip equipment for its Dalian plant. With NAND prices up ~7x since mid-2023, the memory boom is negotiating leverage. We dissect the deal where export controls meet industrial policy.
Analysis
ByteDance is in advanced talks with MediaTek over custom AI chips for data centers. Blocked from Nvidia's top-tier silicon, China's Big Tech routes around export controls with below-threshold ASICs. MediaTek targets 15–20% of an USD 80B 2027 market — the economics of a regulation-designed market.
VLSI Korea